Eric Beyne

Person

Heverlee, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, assembly and method for wafer-to-wafer hybrid bonding
- Patent number 11,769,750
- Issue date Sep 26, 2023
- Imec VZW
- Joeri De Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a semiconductor substrate into a plurality of dies
- Patent number 11,476,162
- Issue date Oct 18, 2022
- Imec VZW
- Frank Holsteyns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductor dies
- Patent number 11,462,420
- Issue date Oct 4, 2022
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductor dies
- Patent number 11,367,705
- Issue date Jun 21, 2022
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an optical device
- Patent number 11,316,066
- Issue date Apr 26, 2022
- Imec VZW
- Soeren Steudel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting a buried interconnect rail of an integrated c...
- Patent number 10,985,057
- Issue date Apr 20, 2021
- Imec VZW
- Anne Jourdain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with power delivery network on the backside...
- Patent number 10,636,739
- Issue date Apr 28, 2020
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling of electronic devices
- Patent number 10,334,755
- Issue date Jun 25, 2019
- Imec VZW
- Herman Oprins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biocompatible packaging
- Patent number 10,271,796
- Issue date Apr 30, 2019
- IMEC
- Maria Op De Beeck
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
MIMCAP structure in a semiconductor device package
- Patent number 10,256,183
- Issue date Apr 9, 2019
- IMEC
- Mikael Detalle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and interconnecting integrated circuit devices
- Patent number 10,170,450
- Issue date Jan 1, 2019
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for self-aligned solder reflow bonding and devices obtained...
- Patent number 9,978,710
- Issue date May 22, 2018
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of producing the package
- Patent number 9,966,325
- Issue date May 8, 2018
- Imec VZW
- Eric Beyne
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for bonding and interconnecting integrated circuit devices
- Patent number 9,960,080
- Issue date May 1, 2018
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,799,632
- Issue date Oct 24, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-substrate vias
- Patent number 9,646,930
- Issue date May 9, 2017
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for insertion bonding and device thus obtained
- Patent number 9,508,665
- Issue date Nov 29, 2016
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible packaging
- Patent number 9,048,198
- Issue date Jun 2, 2015
- IMEC
- Maria Op De Beeck
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Window interposed die packaging
- Patent number 8,907,471
- Issue date Dec 9, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing oxide layers
- Patent number 8,822,330
- Issue date Sep 2, 2014
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating through substrate vias
- Patent number 8,809,188
- Issue date Aug 19, 2014
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming isolation trenches
- Patent number 8,742,590
- Issue date Jun 3, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE
- Publication number 20240297136
- Publication date Sep 5, 2024
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY
- Publication number 20240222260
- Publication date Jul 4, 2024
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC COMPONENT COMBINING POWER DELIVERY AND COOLING FRO...
- Publication number 20240213120
- Publication date Jun 27, 2024
- IMEC vzw
- Herman Oprins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING MICRO-ELECTRONIC COMPONENTS
- Publication number 20240203965
- Publication date Jun 20, 2024
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND SYSTEM FOR COOLING AN ELECTRONIC COMPONENT
- Publication number 20240121914
- Publication date Apr 11, 2024
- IMEC vzw
- Vladimir Cherman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
- Publication number 20230200263
- Publication date Jun 22, 2023
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT INCLUDING BACK SIDE INPUT/OUTPUT SIGNAL ROU...
- Publication number 20230170297
- Publication date Jun 1, 2023
- IMEC vzw
- Shih-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN INTEGRATED CIRCUIT CHIP INCLUDING A BACK-SID...
- Publication number 20230142597
- Publication date May 11, 2023
- IMEC vzw
- Anabela Veloso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING BACK SIDE POWER DELIVERY TRACKS
- Publication number 20230080522
- Publication date Mar 16, 2023
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO PRODUCE DIES FOR A WAFER RECONSTITUTION
- Publication number 20220189830
- Publication date Jun 16, 2022
- MICLEDI MICRODISPLAYS BV
- Eric BEYNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, ASSEMBLY AND METHOD FOR WAFER-TO-WAFER HYBRID BONDING
- Publication number 20220037283
- Publication date Feb 3, 2022
- IMEC vzw
- Joeri De Vos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Dicing a Semiconductor Substrate into a Plurality of Dies
- Publication number 20210098299
- Publication date Apr 1, 2021
- IMEC vzw
- Frank Holsteyns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTOR DIES
- Publication number 20200203309
- Publication date Jun 25, 2020
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Optical Device
- Publication number 20200185566
- Publication date Jun 11, 2020
- IMEC vzw
- Soeren Steudel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING A BURIED INTERCONNECT RAIL OF AN INTEGRATED C...
- Publication number 20200152508
- Publication date May 14, 2020
- IMEC vzw
- Anne Jourdain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTOR DIES
- Publication number 20200118840
- Publication date Apr 16, 2020
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH POWER DELIVERY NETWORK ON THE BACKSIDE...
- Publication number 20180145030
- Publication date May 24, 2018
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR CHIPS TO A LANDING WAFER
- Publication number 20180130765
- Publication date May 10, 2018
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES
- Publication number 20180068984
- Publication date Mar 8, 2018
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF PRODUCING THE PACKAGE
- Publication number 20180061741
- Publication date Mar 1, 2018
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170194246
- Publication date Jul 6, 2017
- IMEC
- Mikael Detalle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ALIGNED SOLDER REFLOW BONDING AND DEVICES OBTAINED...
- Publication number 20170194283
- Publication date Jul 6, 2017
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING OF ELECTRONIC DEVICES
- Publication number 20170196120
- Publication date Jul 6, 2017
- IMEC vzw
- Herman Oprins
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Aligning Micro-Electronic Components
- Publication number 20170186733
- Publication date Jun 29, 2017
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES
- Publication number 20170005000
- Publication date Jan 5, 2017
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20160155699
- Publication date Jun 2, 2016
- IMEC
- Mikael Detalle
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of direct bonding semiconductor components

Substrate, assembly and method for wafer-to-wafer hybrid bonding

Method for dicing a semiconductor substrate into a plurality of dies

Method for packaging semiconductor dies

Method for packaging semiconductor dies

Method for the electrical bonding of semiconductor components

Method for fabricating an optical device

Method for contacting a buried interconnect rail of an integrated c...

Method of bonding semiconductor substrates

Method for bonding semiconductor chips to a landing wafer

Integrated circuit chip with power delivery network on the backside...

Method for producing contact areas on a semiconductor substrate

Liquid cooling of electronic devices

Biocompatible packaging

MIMCAP structure in a semiconductor device package

Method for bonding and interconnecting integrated circuit devices

Method of bonding semiconductor substrates

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Method for self-aligned solder reflow bonding and devices obtained...

Semiconductor die package and method of producing the package

Method for bonding and interconnecting integrated circuit devices

Method for aligning micro-electronic components

Semiconductor device having through-substrate vias

Method for aligning micro-electronic components

Method for insertion bonding and device thus obtained

Biocompatible packaging

Window interposed die packaging

Method for providing oxide layers

Method for fabricating through substrate vias

Method for forming isolation trenches

Patents Applicationslast 30 patents

METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE

SEMICONDUCTOR COMPONENT WITH METAL-INSULATOR-METAL CAPACITOR ASSEMBLY

MICRO-ELECTRONIC COMPONENT COMBINING POWER DELIVERY AND COOLING FRO...

METHOD FOR BONDING AND INTERCONNECTING MICRO-ELECTRONIC COMPONENTS

DEVICE AND SYSTEM FOR COOLING AN ELECTRONIC COMPONENT

Quantum Bit Chip and Method for Fabricating Quantum Bit Chip

SEMICONDUCTOR COMPONENT INCLUDING BACK SIDE INPUT/OUTPUT SIGNAL ROU...

METHOD OF PRODUCING AN INTEGRATED CIRCUIT CHIP INCLUDING A BACK-SID...

INTEGRATED CIRCUIT CHIP INCLUDING BACK SIDE POWER DELIVERY TRACKS

METHOD AND SYSTEM TO PRODUCE DIES FOR A WAFER RECONSTITUTION

SUBSTRATE, ASSEMBLY AND METHOD FOR WAFER-TO-WAFER HYBRID BONDING

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

Method for Dicing a Semiconductor Substrate into a Plurality of Dies

METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS

METHOD FOR PACKAGING SEMICONDUCTOR DIES

Method for Fabricating an Optical Device

METHOD FOR CONTACTING A BURIED INTERCONNECT RAIL OF AN INTEGRATED C...

METHOD FOR PACKAGING SEMICONDUCTOR DIES

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

INTEGRATED CIRCUIT CHIP WITH POWER DELIVERY NETWORK ON THE BACKSIDE...

METHOD FOR BONDING SEMICONDUCTOR CHIPS TO A LANDING WAFER

METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DIE PACKAGE AND METHOD OF PRODUCING THE PACKAGE

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR SELF-ALIGNED SOLDER REFLOW BONDING AND DEVICES OBTAINED...

LIQUID COOLING OF ELECTRONIC DEVICES

Method for Aligning Micro-Electronic Components

METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES

MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE