Eric Brion Acquitan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,817,407
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with high voltage isolation
- Patent number 11,355,460
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220278060
- Publication date Sep 1, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH HIGH VOLTAGE ISOLATION
- Publication number 20220181280
- Publication date Jun 9, 2022
- Shao Ping Wan
- H01 - BASIC ELECTRIC ELEMENTS