Eric C Gantner

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect for a flexible electronic package
- Patent number 10,354,957
- Issue date Jul 16, 2019
- Intel Corporation
- Bok Eng Cheah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HINGED COMPUTING DEVICES HAVING INTRA-DEVICE WIRELESS COMMUNICATIONS
- Publication number 20250172967
- Publication date May 29, 2025
- Intel Corporation
- Jo-han YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROTATING CIRCULAR WAVEGUIDE CHANNEL FOR FOLDABLE ELECTRONIC DEVICES
- Publication number 20250004222
- Publication date Jan 2, 2025
- Intel Corporation
- Debabani Choudhury
- G02 - OPTICS
Information Patent Application
HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING
- Publication number 20200170113
- Publication date May 28, 2020
- Chaitanya Sreerama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL INTERCONNECT FOR A FLEXIBLE ELECTRONIC PACKAGE
- Publication number 20180350748
- Publication date Dec 6, 2018
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS