Eric Cornelis Egbertus VAN GRUNSVEN

Person

Someren, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Optical and thermal improvement of a two-sided multi-channel filament
- Patent number 12,092,271
- Issue date Sep 17, 2024
- SIGNIFY HOLDING B.V.
- Martinus Arnoldus Cornelis Heijmans
- F21 - LIGHTING
Information Patent Grant
Particulate water-activatable luminescent materials
- Patent number 10,107,489
- Issue date Oct 23, 2018
- Philips Lighting Holding B.V.
- Eric Cornelis Egbertus Van Grunsven
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Low warpage wafer bonding through use of slotted substrates
- Patent number 10,084,110
- Issue date Sep 25, 2018
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid immersion transfer of electronics
- Patent number 9,961,778
- Issue date May 1, 2018
- Philips Lighting Holding B.V.
- Esther Anna Wilhelmina Gerarda Janssen
- B44 - DECORATIVE ARTS
Information Patent Grant
Detector
- Patent number 9,753,156
- Issue date Sep 5, 2017
- Koninklijke Philips N.V.
- Frank Verbakel
- G01 - MEASURING TESTING
Information Patent Grant
Low warpage wafer bonding through use of slotted substrates
- Patent number 9,583,676
- Issue date Feb 28, 2017
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive components for DC/DC converters and methods of manufactur...
- Patent number 8,416,047
- Issue date Apr 9, 2013
- NXP B.V.
- Johannes Wilhelmus Weekamp
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Through-substrate via and redistribution layer with metal paste
- Patent number 8,395,267
- Issue date Mar 12, 2013
- NXP B.V.
- Freddy Roozeboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit
- Patent number 8,138,087
- Issue date Mar 20, 2012
- NXP B.V.
- Stephane Morel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL AND THERMAL IMPROVEMENT OF A TWO-SIDED MULTI-CHANNEL FILAMENT
- Publication number 20240183501
- Publication date Jun 6, 2024
- SIGNIFY HOLDING B.V.
- MARTINUS ARNOLDUS CORNELIS HEIJMANS
- F21 - LIGHTING
Information Patent Application
A METHOD OF APPLYING A LIGHTING ARRANGEMENT TO A SURFACE AND A LIGH...
- Publication number 20170294420
- Publication date Oct 12, 2017
- Egbertus Reinier JACOBS
- B60 - VEHICLES IN GENERAL
Information Patent Application
PARTICULATE WATER-ACTIVATABLE LUMINESCENT MATERIALS
- Publication number 20170254528
- Publication date Sep 7, 2017
- Eric Cornelis Egbertus VAN GRUNSVEN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES
- Publication number 20170200853
- Publication date Jul 13, 2017
- Koninklijke Philips N.V.
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATED LIGHTING OR LUMINATION SYSTEM
- Publication number 20170184281
- Publication date Jun 29, 2017
- Marc Andre DE SAMBER
- F21 - LIGHTING
Information Patent Application
LIQUID IMMERSION TRANSFER OF ELECTRONICS
- Publication number 20160198577
- Publication date Jul 7, 2016
- Koninklijke Philips N.V.
- Esther Anna Wilhelmina Gerarda Janssen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTOR
- Publication number 20150362604
- Publication date Dec 17, 2015
- Frank VERBAKEL
- G01 - MEASURING TESTING
Information Patent Application
LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES
- Publication number 20140252405
- Publication date Sep 11, 2014
- Marc Andre De Samber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR MICRO DEVICE PACKAGING
- Publication number 20090279575
- Publication date Nov 12, 2009
- Koninklijke Philips Electronics, N.V.
- Eric C.E. van Grunsven
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT
- Publication number 20090267232
- Publication date Oct 29, 2009
- NXP, B.V.
- Stephane Morel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing same
- Publication number 20070052091
- Publication date Mar 8, 2007
- Koninklijke Philips Electronics N.V.
- Johannus Wilhelmus Weekamp
- H01 - BASIC ELECTRIC ELEMENTS

Eric Cornelis Egbertus VAN GRUNSVEN

Person

Patents Grantslast 30 patents

Optical and thermal improvement of a two-sided multi-channel filament

Particulate water-activatable luminescent materials

Low warpage wafer bonding through use of slotted substrates

Liquid immersion transfer of electronics

Detector

Low warpage wafer bonding through use of slotted substrates

Fan-out chip scale package

Inductive components for DC/DC converters and methods of manufactur...

Through-substrate via and redistribution layer with metal paste

Method of manufacturing an integrated circuit

Patents Applicationslast 30 patents

OPTICAL AND THERMAL IMPROVEMENT OF A TWO-SIDED MULTI-CHANNEL FILAMENT

A METHOD OF APPLYING A LIGHTING ARRANGEMENT TO A SURFACE AND A LIGH...

PARTICULATE WATER-ACTIVATABLE LUMINESCENT MATERIALS

LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES

CONFORMAL COATED LIGHTING OR LUMINATION SYSTEM

LIQUID IMMERSION TRANSFER OF ELECTRONICS

DETECTOR

LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES

FAN-OUT CHIP SCALE PACKAGE

CARRIER SUBSTRATE FOR MICRO DEVICE PACKAGING

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT

Electronic device and method of manufacturing same