Eric D. Lakin

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Chippewa Falls, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Flexible and adaptable computing system infrastructure
- Patent number 10,842,040
- Issue date Nov 17, 2020
- Hewlett Packard Enterprise Development LP
- Wade Doll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transverse cooling system and method
- Patent number 10,034,416
- Issue date Jul 24, 2018
- Cray Inc.
- Gregory W. Pautsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack mounted electronics having connectors with heat cooling fingers
- Patent number 9,185,828
- Issue date Nov 10, 2015
- Cray Inc.
- Corey Knudsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transverse cooling system and method
- Patent number 9,167,726
- Issue date Oct 20, 2015
- Cray Inc.
- Gregory W. Pautsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for cooling electronic components
- Patent number 6,366,461
- Issue date Apr 2, 2002
- Silicon Graphics, Inc.
- Gregory W. Pautsch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE AND ADAPTABLE COMPUTING SYSTEM INFRASTRUCTURE
- Publication number 20200214164
- Publication date Jul 2, 2020
- Cray Inc.
- Wade Doll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSVERSE COOLING SYSTEM AND METHOD
- Publication number 20160044828
- Publication date Feb 11, 2016
- Cray Inc.
- Gregory W. Pautsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RACK MOUNTED ELECTRONICS HAVING CONNECTORS WITH HEAT COOLING FINGERS
- Publication number 20130301219
- Publication date Nov 14, 2013
- Corey Knudsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSVERSE COOLING SYSTEM AND METHOD
- Publication number 20130128459
- Publication date May 23, 2013
- Cray Inc.
- Gregory W. Pautsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A HEAT SINK WHICH COOLS MULTIPLE...
- Publication number 20080266806
- Publication date Oct 30, 2008
- Eric D. Lakin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK
- Publication number 20080266807
- Publication date Oct 30, 2008
- Cray Inc.
- Eric D. Lakin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR