Eric G. Webb

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 9,447,505
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 9,074,286
- Issue date Jul 7, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photoresist-free metal deposition
- Patent number 8,500,985
- Issue date Aug 6, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of semiconductor interconnect structure
- Patent number 8,481,432
- Issue date Jul 9, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Topography reduction and control by selective accelerator removal
- Patent number 8,470,191
- Issue date Jun 25, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping before barrier-removal IC fabrication method
- Patent number 8,415,261
- Issue date Apr 9, 2013
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 8,372,757
- Issue date Feb 12, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating-liquid system
- Patent number 8,257,781
- Issue date Sep 4, 2012
- Novellus Systems, Inc.
- Eric G. Webb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposit morphology of electroplated copper
- Patent number 8,197,662
- Issue date Jun 12, 2012
- Novellus Systems, Inc.
- Eric Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Topography reduction and control by selective accelerator removal
- Patent number 8,158,532
- Issue date Apr 17, 2012
- Novellus Systems, Inc.
- Steven T. Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping before barrier-removal IC fabrication method
- Patent number 8,043,958
- Issue date Oct 25, 2011
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of semiconductor interconnect structure
- Patent number 7,972,970
- Issue date Jul 5, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photoresist-free metal deposition
- Patent number 7,947,163
- Issue date May 24, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless layer plating process and apparatus
- Patent number 7,897,198
- Issue date Mar 1, 2011
- Novellus Systems, Inc.
- Heung L. Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposit morphology of electroplated copper
- Patent number 7,879,218
- Issue date Feb 1, 2011
- Novellus Systems, Inc.
- Eric Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Capping before barrier-removal IC fabrication method
- Patent number 7,811,925
- Issue date Oct 12, 2010
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Small-volume electroless plating cell
- Patent number 7,690,324
- Issue date Apr 6, 2010
- Novellus Systems, Inc.
- Jingbin Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping before barrier-removal IC fabrication method
- Patent number 7,605,082
- Issue date Oct 20, 2009
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Anneal of ruthenium seed layer to improve copper plating
- Patent number 7,442,267
- Issue date Oct 28, 2008
- Novellus Systems, Inc.
- Eric G. Webb
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods for the electrochemical deposition of copper onto a barrier...
- Patent number 7,341,946
- Issue date Mar 11, 2008
- Novellus Systems, Inc.
- Sridhar K. Kailasam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating bath containing wetting agent for defect reduction
- Patent number 7,232,513
- Issue date Jun 19, 2007
- Novellus Systems, Inc.
- Eric G. Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating using DC current interruption and variable rotation...
- Patent number 6,884,335
- Issue date Apr 26, 2005
- Novellus Systems, Inc.
- Eric G. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless copper deposition method for preparing copper seed layers
- Patent number 6,664,122
- Issue date Dec 16, 2003
- Novellus Systems, Inc.
- Tatyana N. Andryuschenko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...
- Publication number 20150267306
- Publication date Sep 24, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTORESIST-FREE METAL DEPOSITION
- Publication number 20140014522
- Publication date Jan 16, 2014
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...
- Publication number 20130207030
- Publication date Aug 15, 2013
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20110223772
- Publication date Sep 15, 2011
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wet Etching Methods for Copper Removal and Planarization in Semicon...
- Publication number 20100015805
- Publication date Jan 21, 2010
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Fabrication of semiconductor interconnect structure
- Publication number 20090283499
- Publication date Nov 19, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Topography reduction and control by selective accelerator removal
- Publication number 20090277867
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Topography reduction and control by selective accelerator removal
- Publication number 20090280649
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090277801
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090280243
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for the electrochemical deposition of copper onto a barrier...
- Publication number 20050098440
- Publication date May 12, 2005
- Sridhar K. Kailasam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating using DC current interruption and variable rotation...
- Publication number 20040231996
- Publication date Nov 25, 2004
- Novellus Systems, Inc.
- Eric G. Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Eric G. Webb

Person

Patents Grantslast 30 patents

Wet etching methods for copper removal and planarization in semicon...

Wet etching methods for copper removal and planarization in semicon...

Photoresist-free metal deposition

Fabrication of semiconductor interconnect structure

Topography reduction and control by selective accelerator removal

Capping before barrier-removal IC fabrication method

Wet etching methods for copper removal and planarization in semicon...

Electroless plating-liquid system

Deposit morphology of electroplated copper

Topography reduction and control by selective accelerator removal

Capping before barrier-removal IC fabrication method

Fabrication of semiconductor interconnect structure

Photoresist-free metal deposition

Electroless layer plating process and apparatus

Deposit morphology of electroplated copper

Capping before barrier-removal IC fabrication method

Small-volume electroless plating cell

Capping before barrier-removal IC fabrication method

Anneal of ruthenium seed layer to improve copper plating

Methods for the electrochemical deposition of copper onto a barrier...

Electroplating bath containing wetting agent for defect reduction

Electroplating using DC current interruption and variable rotation...

Electroless copper deposition method for preparing copper seed layers

Patents Applicationslast 30 patents

WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...

PHOTORESIST-FREE METAL DEPOSITION

WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...

FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURE

Wet Etching Methods for Copper Removal and Planarization in Semicon...

Fabrication of semiconductor interconnect structure

Topography reduction and control by selective accelerator removal

Topography reduction and control by selective accelerator removal

Photoresist-free metal deposition

Photoresist-free metal deposition

Methods for the electrochemical deposition of copper onto a barrier...

Electroplating using DC current interruption and variable rotation...