Eric Gerhard Liniger

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Danbury, CT, US

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Patents Grantslast 30 patents

Information Patent Grant
Predicting semiconductor package warpage
- Patent number 10,309,884
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Predicting semiconductor package warpage
- Patent number 9,772,268
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Methods of forming liquid display panels and the like wherein using...
- Patent number 6,636,290
- Issue date Oct 21, 2003
- International Business Machines Corporation
- James Henry Glownia
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
PREDICTING SEMICONDUCTOR PACKAGE WARPAGE
- Publication number 20170284913
- Publication date Oct 5, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
PREDICTING SEMICONDUCTOR PACKAGE WARPAGE
- Publication number 20160290905
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING