Eric Herman Laine

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of producing plastic pin grid array
- Patent number 6,438,830
- Issue date Aug 27, 2002
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin attach structure for an electronic package
- Patent number 5,952,716
- Issue date Sep 14, 1999
- International Business Machines Corporation
- Eric P. Dibble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 5,939,783
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Eric Herman Laine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 5,751,060
- Issue date May 12, 1998
- International Business Machines Corporation
- Eric Herman Laine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic Package
- Patent number 5,728,606
- Issue date Mar 17, 1998
- International Business Machines Corporation
- Eric Herman Laine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 5,616,958
- Issue date Apr 1, 1997
- International Business Machines Corporation
- Eric H. Laine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS

Eric Herman Laine

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having i...

Interconnection for flip-chip using lead-free solders and having im...

Process of producing plastic pin grid array

Pin attach structure for an electronic package

Electronic package

Electronic package

Electronic Package

Electronic package

Patents Applicationslast 30 patents

Interconnection for flip-chip using lead-free solders and having im...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...