Eric J. Chapman

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die stacked power delivery
- Patent number 11,960,339
- Issue date Apr 16, 2024
- Advanced Micro Devices, Inc.
- Eric J. Chapman
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES AND METHODS FOR BRIDGE-BASED PACKAGING WITH DIRECT POWE...
- Publication number 20250201722
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFAC...
- Publication number 20240113004
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- GABRIEL H. LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE STACKED POWER DELIVERY
- Publication number 20230009881
- Publication date Jan 12, 2023
- Eric J. Chapman
- G06 - COMPUTING CALCULATING COUNTING