Eric J. Li

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked die cavity package
- Patent number 11,705,377
- Issue date Jul 18, 2023
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wafer-level active die and external di...
- Patent number 11,545,441
- Issue date Jan 3, 2023
- Intel Corporation
- Vipul Vijay Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die cavity package
- Patent number 11,328,968
- Issue date May 10, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 11,114,388
- Issue date Sep 7, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,089,689
- Issue date Aug 10, 2021
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wafer-level active die and external di...
- Patent number 10,910,317
- Issue date Feb 2, 2021
- Intel Corporation
- Vipul Vijay Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 10,707,171
- Issue date Jul 7, 2020
- Intel Corporation
- Tomita Yoshihiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 10,672,626
- Issue date Jun 2, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,615,128
- Issue date Apr 7, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with high frequency communication...
- Patent number 10,573,608
- Issue date Feb 25, 2020
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package with through-mold thermally conductive structur...
- Patent number 10,541,190
- Issue date Jan 21, 2020
- Intel Corporation
- Chandra Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable ball height on ball grid array packages by solder paste tr...
- Patent number 10,504,863
- Issue date Dec 10, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package assembly with compact die placement
- Patent number 10,373,888
- Issue date Aug 6, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 10,325,866
- Issue date Jun 18, 2019
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable ball height on ball grid array packages by solder paste tr...
- Patent number 10,256,205
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 10,256,198
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 10,249,515
- Issue date Apr 2, 2019
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically shielded electronic devices and related systems...
- Patent number 10,224,290
- Issue date Mar 5, 2019
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature thin wafer backside vacuum process with backgrindin...
- Patent number 10,224,223
- Issue date Mar 5, 2019
- Intel Corporation
- Eric J. Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electromagnetic interference shielding for system-in-package techno...
- Patent number 10,163,810
- Issue date Dec 25, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture material and process to improve thermal performance of...
- Patent number 10,121,722
- Issue date Nov 6, 2018
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,991,211
- Issue date Jun 5, 2018
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 9,953,929
- Issue date Apr 24, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helically insulated twinax cable systems and methods
- Patent number 9,922,751
- Issue date Mar 20, 2018
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 9,847,304
- Issue date Dec 19, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20220344273
- Publication date Oct 27, 2022
- Intel Corporation
- Toshihiro TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE CAVITY PACKAGE
- Publication number 20220238402
- Publication date Jul 28, 2022
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20210391281
- Publication date Dec 16, 2021
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...
- Publication number 20210082826
- Publication date Mar 18, 2021
- Intel Corporation
- Vipul Vijay MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20200286834
- Publication date Sep 10, 2020
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE CAVITY PACKAGE
- Publication number 20200185289
- Publication date Jun 11, 2020
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...
- Publication number 20190279938
- Publication date Sep 12, 2019
- Intel Corporation
- Vipul Vijay MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20190259713
- Publication date Aug 22, 2019
- Intel Corporation
- ERIC J. LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190228988
- Publication date Jul 25, 2019
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20190098764
- Publication date Mar 28, 2019
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20190096838
- Publication date Mar 28, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...
- Publication number 20180366421
- Publication date Dec 20, 2018
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE
- Publication number 20180358296
- Publication date Dec 13, 2018
- Intel Corporation
- Eric J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20180337129
- Publication date Nov 22, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20180337135
- Publication date Nov 22, 2018
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...
- Publication number 20180331051
- Publication date Nov 15, 2018
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE WITH THROUGH-MOLD THERMALLY CONDUCTIVE STRUCTUR...
- Publication number 20180308784
- Publication date Oct 25, 2018
- Intel Corporation
- Chandra M. JHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
- Publication number 20180277492
- Publication date Sep 27, 2018
- Intel Corporation
- ERIC J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180226358
- Publication date Aug 9, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY WITH COMPACT DIE PLACEMENT
- Publication number 20180190560
- Publication date Jul 5, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20180068969
- Publication date Mar 8, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
- Publication number 20170287851
- Publication date Oct 5, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20170287735
- Publication date Oct 5, 2017
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICALLY INSULATED TWINAX CABLE SYSTEMS AND METHODS
- Publication number 20170287591
- Publication date Oct 5, 2017
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20170278816
- Publication date Sep 28, 2017
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170271270
- Publication date Sep 21, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fine feature formation techniques for printed circuit boards

Stacked die cavity package

Electronic assembly that includes a bridge

Semiconductor package having wafer-level active die and external di...

Stacked die cavity package

Warpage control for microelectronics packages

Fine feature formation techniques for printed circuit boards

Microelectronic structures having multiple microelectronic devices...

Semiconductor package having wafer-level active die and external di...

Microelectronic structures having multiple microelectronic devices...

Ultra small molded module integrated with die by module-on-wafer as...

Method and materials for warpage thermal and interconnect solutions

Systems and methods for electromagnetic interference shielding

Microelectronic devices designed with high frequency communication...

Stacked die package with through-mold thermally conductive structur...

Variable ball height on ball grid array packages by solder paste tr...

Microelectronic structures having multiple microelectronic devices...

Electronic package assembly with compact die placement

Electronic device packages with conformal EMI shielding and related...

Variable ball height on ball grid array packages by solder paste tr...

Warpage control for microelectronics packages

Electronic device package

Electromagnetically shielded electronic devices and related systems...

Low temperature thin wafer backside vacuum process with backgrindin...

Electromagnetic interference shielding for system-in-package techno...

Architecture material and process to improve thermal performance of...

Semiconductor package having an EMI shielding layer

Systems and methods for electromagnetic interference shielding

Helically insulated twinax cable systems and methods

Electronic device packages with conformal EMI shielding and related...

Patents Applicationslast 30 patents

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

STACKED DIE CAVITY PACKAGE

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

STACKED DIE CAVITY PACKAGE

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

ELECTRONIC DEVICE PACKAGE

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...

ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION...

STACKED DIE PACKAGE WITH THROUGH-MOLD THERMALLY CONDUCTIVE STRUCTUR...

WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

ELECTRONIC PACKAGE ASSEMBLY WITH COMPACT DIE PLACEMENT

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

ELECTRONIC DEVICE PACKAGE

HELICALLY INSULATED TWINAX CABLE SYSTEMS AND METHODS

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING