Eric J. M. Moret

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus to reduce thermal fluctuations in semiconduct...
- Patent number 12,135,569
- Issue date Nov 5, 2024
- Intel Corporation
- Rodrigo De Oliveira Vivi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for fast, passive alignment in photonics assembly
- Patent number 11,808,988
- Issue date Nov 7, 2023
- Intel Corporation
- Vineeth Abraham
- G02 - OPTICS
Information Patent Grant
Method and system for attaching optical fibers to warped photonic c...
- Patent number 11,762,157
- Issue date Sep 19, 2023
- Intel Corporation
- Sufi Ahmed
- G02 - OPTICS
Information Patent Grant
Adaptive thermal actuator array for wafer-level applications
- Patent number 10,120,018
- Issue date Nov 6, 2018
- Intel Corporation
- Eric J. M. Moret
- G01 - MEASURING TESTING
Information Patent Grant
Methods and devices for securing and transporting singulated die in...
- Patent number 9,929,031
- Issue date Mar 27, 2018
- Intel Corporation
- John C. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing fast throughput...
- Patent number 9,835,679
- Issue date Dec 5, 2017
- Intel Corporation
- Eric J. M. Moret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for securing and transporting singulated die in...
- Patent number 9,496,161
- Issue date Nov 15, 2016
- Intel Corporation
- John C. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for securing and transporting singulated die in...
- Patent number 9,305,816
- Issue date Apr 5, 2016
- Intel Corporation
- John C. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism for facilitating modular processing cell framework and ap...
- Patent number 9,279,854
- Issue date Mar 8, 2016
- Intel Corporation
- John C. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Positioning and socketing for semiconductor dice
- Patent number 8,797,053
- Issue date Aug 5, 2014
- Intel Corporation
- Michael L. Rutigliano
- G01 - MEASURING TESTING
Information Patent Grant
Temporary package for at-speed functional test of semiconductor chip
- Patent number 7,960,190
- Issue date Jun 14, 2011
- Intel Corporation
- Eric J. M. Moret
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS...
- Publication number 20240176167
- Publication date May 30, 2024
- Intel Corporation
- Benjamin DUONG
- G02 - OPTICS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20240111098
- Publication date Apr 4, 2024
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20240094476
- Publication date Mar 21, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING
- Publication number 20240027706
- Publication date Jan 25, 2024
- Intel Corporation
- Pooya Tadayon
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES
- Publication number 20240027697
- Publication date Jan 25, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
SELF-DOCKING SELF-ALIGNED OPTICAL PCB CONNECTOR FOR SEMICONDUCTOR P...
- Publication number 20230314733
- Publication date Oct 5, 2023
- Intel Corporation
- Eric MORET
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...
- Publication number 20230204877
- Publication date Jun 29, 2023
- Intel Corporation
- John M. Heck
- G02 - OPTICS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...
- Publication number 20230185037
- Publication date Jun 15, 2023
- Intel Corporation
- Eric J. M. Moret
- G02 - OPTICS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR STABLE AND ELEVATED IDLE-MODE TEMPERATURE F...
- Publication number 20230101997
- Publication date Mar 30, 2023
- Intel Corporation
- Nikos Kaburlasos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL CIRCUIT WITH OPTICAL PORT IN SIDEWALL
- Publication number 20230092060
- Publication date Mar 23, 2023
- Intel Corporation
- Eric J.M. Moret
- G02 - OPTICS
Information Patent Application
OPTICAL CIRCUIT WITH LENS AT SUBSTRATE EDGE
- Publication number 20230087567
- Publication date Mar 23, 2023
- Intel Corporation
- Eric J.M. Moret
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...
- Publication number 20230077633
- Publication date Mar 16, 2023
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
METHOD AND SYSTEM FOR ATTACHING OPTICAL FIBERS TO WARPED PHOTONIC C...
- Publication number 20220011529
- Publication date Jan 13, 2022
- Intel Corporation
- Sufi AHMED
- G02 - OPTICS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20220011517
- Publication date Jan 13, 2022
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS TO REDUCE THERMAL FLUCTUATIONS IN SEMICONDUCT...
- Publication number 20210223805
- Publication date Jul 22, 2021
- Intel Corporation
- Rodrigo De Oliveira Vivi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADAPTIVE THERMAL ACTUATOR ARRAY FOR WAFER-LEVEL APPLICATIONS
- Publication number 20180067160
- Publication date Mar 8, 2018
- Intel Corporation
- Eric J.M. Moret
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20170032991
- Publication date Feb 2, 2017
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20160172222
- Publication date Jun 16, 2016
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20150187622
- Publication date Jul 2, 2015
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FACILITATING MODULAR PROCESSING CELL FRAMEWORK AND AP...
- Publication number 20140184255
- Publication date Jul 3, 2014
- JOHN C. JOHNSON
- G01 - MEASURING TESTING
Information Patent Application
POSITIONING AND SOCKETING FOR SEMICONDUCTOR DICE
- Publication number 20120299609
- Publication date Nov 29, 2012
- Michael L. Rutigliano
- G01 - MEASURING TESTING
Information Patent Application
TEMPORARY PACKAGE FOR AT-SPEED FUNCTIONAL TEST OF SEMICONDUCTOR CHIP
- Publication number 20100151598
- Publication date Jun 17, 2010
- Eric J. M. Moret
- G01 - MEASURING TESTING

Eric J. M. Moret

Person

Patents Grantslast 30 patents

Methods and apparatus to reduce thermal fluctuations in semiconduct...

Method and device for fast, passive alignment in photonics assembly

Method and system for attaching optical fibers to warped photonic c...

Adaptive thermal actuator array for wafer-level applications

Methods and devices for securing and transporting singulated die in...

Systems, methods, and apparatuses for implementing fast throughput...

Methods and devices for securing and transporting singulated die in...

Methods and devices for securing and transporting singulated die in...

Mechanism for facilitating modular processing cell framework and ap...

Positioning and socketing for semiconductor dice

Temporary package for at-speed functional test of semiconductor chip

Patents Applicationslast 30 patents

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS...

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY

TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR

PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING

PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES

SELF-DOCKING SELF-ALIGNED OPTICAL PCB CONNECTOR FOR SEMICONDUCTOR P...

TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

SYSTEMS AND METHODS FOR STABLE AND ELEVATED IDLE-MODE TEMPERATURE F...

OPTICAL CIRCUIT WITH OPTICAL PORT IN SIDEWALL

OPTICAL CIRCUIT WITH LENS AT SUBSTRATE EDGE

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...

METHOD AND SYSTEM FOR ATTACHING OPTICAL FIBERS TO WARPED PHOTONIC C...

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY

METHODS AND APPARATUS TO REDUCE THERMAL FLUCTUATIONS IN SEMICONDUCT...

ADAPTIVE THERMAL ACTUATOR ARRAY FOR WAFER-LEVEL APPLICATIONS

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

MECHANISM FOR FACILITATING MODULAR PROCESSING CELL FRAMEWORK AND AP...

POSITIONING AND SOCKETING FOR SEMICONDUCTOR DICE

TEMPORARY PACKAGE FOR AT-SPEED FUNCTIONAL TEST OF SEMICONDUCTOR CHIP