Eric Ko

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Ball grid array semiconductor package and substrate without power r...
- Patent number 6,667,546
- Issue date Dec 23, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch wafer bumping process
- Patent number 6,555,296
- Issue date Apr 29, 2003
- Siliconware Precision Industries Co., Ltd.
- Raymond Jao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-frame-based chip-scale package and method of manufacturing the...
- Patent number 6,427,976
- Issue date Aug 6, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-lead package of semiconductor
- Patent number 6,414,385
- Issue date Jul 2, 2002
- Siliconware Precisionindustries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a ball grid array integrated circuit package...
- Patent number 6,306,682
- Issue date Oct 23, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module package structure
- Patent number 6,281,578
- Issue date Aug 28, 2001
- Siliconware Precision Industries, Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-grid array integrated circuit package with an embedded type of...
- Patent number 6,282,094
- Issue date Aug 28, 2001
- Siliconware Precision Industries, Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated circuit package structure for central pad chip
- Patent number 6,265,763
- Issue date Jul 24, 2001
- Siliconware Precision Industries Co., Ltd.
- Jui-Meng Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal lead frame type of quad flat non-lead package of semicond...
- Patent number 6,246,111
- Issue date Jun 12, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced quad flat non-lead package of semiconductor
- Patent number 6,198,171
- Issue date Mar 6, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ball grid array semiconductor package
- Publication number 20030089983
- Publication date May 15, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine pitch wafer bumping process
- Publication number 20020146646
- Publication date Oct 10, 2002
- Raymond Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FRAME-BASED CHIP-SCALE PACKAGE AND METHOD OF MANUFACTURING THE...
- Publication number 20020070433
- Publication date Jun 13, 2002
- CHIEN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Ball grid array semiconductor package and substrate without power r...

Fine pitch wafer bumping process

Lead-frame-based chip-scale package and method of manufacturing the...

Quad flat non-lead package of semiconductor

Method of fabricating a ball grid array integrated circuit package...

Multi-chip module package structure

Ball-grid array integrated circuit package with an embedded type of...

Multi-chip integrated circuit package structure for central pad chip

Universal lead frame type of quad flat non-lead package of semicond...

Thermally enhanced quad flat non-lead package of semiconductor

Patents Applicationslast 30 patents

Ball grid array semiconductor package

Fine pitch wafer bumping process

LEAD-FRAME-BASED CHIP-SCALE PACKAGE AND METHOD OF MANUFACTURING THE...