Eric Kurt Zwirnmann

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Horsham, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Two etch method for achieving a wafer thickness profile
- Patent number 10,553,502
- Issue date Feb 4, 2020
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to control etch rate through adaptive spiking...
- Patent number 10,446,387
- Issue date Oct 15, 2019
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of etching the back of a wafer to expose TSVs
- Patent number 10,026,660
- Issue date Jul 17, 2018
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR PERFORMING A WET ETCHING PROCESS
- Publication number 20180294196
- Publication date Oct 11, 2018
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD TO CONTROL ETCH RATE THROUGH ADAPTIVE SPIKING...
- Publication number 20170287793
- Publication date Oct 5, 2017
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR PERFORMING A WET ETCHING PROCESS
- Publication number 20160126148
- Publication date May 5, 2016
- VEECO PRECISION SURFACE PROCESSING LLC
- Laura Mauer
- H01 - BASIC ELECTRIC ELEMENTS