Eric M. Radza

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Spring connector for making electrical contact at semiconductor scales
- Patent number 7,989,945
- Issue date Aug 2, 2011
- Neoconix, Inc.
- John David Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for batch forming spring elements in three dimens...
- Patent number 7,597,561
- Issue date Oct 6, 2009
- Neoconix, Inc.
- Eric M. Radza
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for making electrical contact at semiconductor scales
- Patent number 7,244,125
- Issue date Jul 17, 2007
- Neoconix, Inc.
- Dirk D. Brown
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Connector for making electrical contact at semiconductor scales
- Publication number 20070275572
- Publication date Nov 29, 2007
- John David Williams
- G01 - MEASURING TESTING
Information Patent Application
Die package with higher useable die contact pad area
- Publication number 20050205988
- Publication date Sep 22, 2005
- EPIC Technology Inc.
- Eric Michael Radza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for batch forming spring elements in three dimens...
- Publication number 20050164527
- Publication date Jul 28, 2005
- Eric M. Radza
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming MEMS grid array connector
- Publication number 20050120553
- Publication date Jun 9, 2005
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connector for making electrical contact at semiconductor scales
- Publication number 20050124181
- Publication date Jun 9, 2005
- Dirk D. Brown
- G01 - MEASURING TESTING