Eric Ochs

Person

  • Pittsburgh, PA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MEMS CHIP SCALE PACKAGE

    • Publication number 20170113926
    • Publication date Apr 27, 2017
    • ROBERT BOSCH GmbH
    • Eric Ochs
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CAVITY PACKAGE DESIGN

    • Publication number 20160137490
    • Publication date May 19, 2016
    • ROBERT BOSCH GmbH
    • Eric Ochs
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS MICROPHONE PACKAGE WITH MOLDED INTERCONNECT DEVICE

    • Publication number 20140072151
    • Publication date Mar 13, 2014
    • ROBERT BOSCH GmbH
    • Eric Ochs
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CAVITY PACKAGE DESIGN

    • Publication number 20130256815
    • Publication date Oct 3, 2013
    • ROBERT BOSCH GmbH
    • Eric Ochs
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS CHIP SCALE PACKAGE

    • Publication number 20130147040
    • Publication date Jun 13, 2013
    • ROBERT BOSCH GmbH
    • Eric Ochs
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Microphone package and method for manufacturing same

    • Publication number 20120148083
    • Publication date Jun 14, 2012
    • Michael KNAUSS
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SOLDER JOINT INSPECTION

    • Publication number 20120025863
    • Publication date Feb 2, 2012
    • Eric Ochs
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR