Eric Rouya

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Oakland, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Levelers for copper deposition in microelectronics
- Patent number 10,294,574
- Issue date May 21, 2019
- MacDermid Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20200040478
- Publication date Feb 6, 2020
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20190390356
- Publication date Dec 26, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrodeposition of Copper
- Publication number 20160281251
- Publication date Sep 29, 2016
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS
- Publication number 20160076160
- Publication date Mar 17, 2016
- Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR