Eric S. Mindock

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Playa del Rey, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Spacecraft and spacecraft protective blankets
- Patent number 11,718,424
- Issue date Aug 8, 2023
- The Boeing Company
- Eric S. Mindock
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
System and method for shape memory alloy thermal interface
- Patent number 11,225,339
- Issue date Jan 18, 2022
- The Boeing Company
- Eric S. Mindock
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System and method for shape memory alloy thermal interface
- Patent number 10,730,645
- Issue date Aug 4, 2020
- The Boeing Company
- Eric S. Mindock
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Spacecraft and spacecraft protective blankets
- Patent number 10,265,930
- Issue date Apr 23, 2019
- The Boeing Company
- Richard W. Aston
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Encapsulated multi-phase electronics heat-sink
- Patent number 7,561,425
- Issue date Jul 14, 2009
- The Boeing Company
- Eric S. Mindock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SPACECRAFT AND SPACECRAFT PROTECTIVE BLANKETS
- Publication number 20200331640
- Publication date Oct 22, 2020
- The Boeing Company
- Eric S. Mindock
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
SYSTEM AND METHOD FOR SHAPE MEMORY ALLOY THERMAL INTERFACE
- Publication number 20200331639
- Publication date Oct 22, 2020
- The Boeing Company
- Eric S. Mindock
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
System and Method for Shape Memory Alloy Thermal Interface
- Publication number 20180305043
- Publication date Oct 25, 2018
- The Boeing Company
- Eric S. Mindock
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SPACECRAFT AND SPACECRAFT PROTECTIVE BLANKETS
- Publication number 20160200460
- Publication date Jul 14, 2016
- THE BOEING COMPANY
- Richard W. Aston
- B32 - LAYERED PRODUCTS
Information Patent Application
ENCAPSULATED MULTI-PHASE ELECTRONICS HEAT SINK
- Publication number 20070285892
- Publication date Dec 13, 2007
- The Boeing Company
- Eric S. Mindock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR