Eric S. Tosaya

Follow

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for bonding die to substrate using a gold/silicon seed
- Patent number 4,810,671
- Issue date Mar 7, 1989
- Intel Corporation
- Bidyut K. Bhattacharyya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of attaching a die to a substrate using gold/silicon seed
- Patent number 4,771,018
- Issue date Sep 13, 1988
- Intel Corporation
- Bidyut K. Bhattacharyya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR