Eric Tan Swee Seng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 9,269,695
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming assemblies and multi-chip modules including sta...
- Patent number 9,070,641
- Issue date Jun 30, 2015
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 8,384,200
- Issue date Feb 26, 2013
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE
- Publication number 20200365561
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Eric Tan Swee Seng
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE
- Publication number 20150303176
- Publication date Oct 22, 2015
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING FACE-TO-FACE SEMICONDUCTO...
- Publication number 20150076679
- Publication date Mar 19, 2015
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies including face-to-face semiconducto...
- Publication number 20070194415
- Publication date Aug 23, 2007
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Invertible microfeature device packages and associated methods
- Publication number 20060035503
- Publication date Feb 16, 2006
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic component assemblies with recessed wire bonds and m...
- Publication number 20060017177
- Publication date Jan 26, 2006
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced footprint packaged microelectronic components and methods f...
- Publication number 20050093174
- Publication date May 5, 2005
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Invertible microfeature device packages and associated methods
- Publication number 20050046000
- Publication date Mar 3, 2005
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of forming same
- Publication number 20050023655
- Publication date Feb 3, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Eric Tan Swee Seng

Person

Patents Grantslast 30 patents

Multi-chip modules including stacked semiconductor dice

Semiconductor device assemblies including face-to-face semiconducto...

Methods for forming assemblies and multi-chip modules including sta...

Semiconductor device assemblies including face-to-face semiconducto...

Ball grid array interposer, packages and methods

Patents Applicationslast 30 patents

MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE

MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING FACE-TO-FACE SEMICONDUCTO...

Semiconductor device assemblies including face-to-face semiconducto...

Methods for assembling semiconductor devices and interposers

Invertible microfeature device packages and associated methods

Microelectronic component assemblies with recessed wire bonds and m...

Reduced footprint packaged microelectronic components and methods f...

Invertible microfeature device packages and associated methods

Packaged microelectronic devices and methods of forming same