Eric Tan Swee Seng

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
REDUCED FOOTPRINT PACKAGED MICROELECTRONIC COMPONENTS AND METHODS F...
- Publication number 20080067634
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies and multi-chip modules including stacked semiconductor d...
- Publication number 20060202319
- Publication date Sep 14, 2006
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies including stacked semiconductor dice having centrally lo...
- Publication number 20060022323
- Publication date Feb 2, 2006
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic component assemblies
- Publication number 20040100772
- Publication date May 27, 2004
- Lim Thiam Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS OF FORMING SAME
- Publication number 20030042581
- Publication date Mar 6, 2003
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS