Erica L. Poelstra

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies having conductive material...
- Patent number 12,069,852
- Issue date Aug 20, 2024
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming integrated assemblies having conductive material...
- Patent number 11,444,088
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 11,024,735
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies having conductive material...
- Patent number 10,818,673
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Hong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive structures along pillars of semiconduc...
- Patent number 10,461,185
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20240365538
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20220344350
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Hong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20210265500
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20210028177
- Publication date Jan 28, 2021
- Micron Technology, Inc.
- Hong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20200111797
- Publication date Apr 9, 2020
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Application
Methods of Forming Integrated Circuitry
- Publication number 20200052113
- Publication date Feb 13, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20190198668
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Erica L. Poelstra

Person

Patents Grantslast 30 patents

Transistor structures having conductive structures along pillars of...

Methods of forming integrated assemblies having conductive material...

Methods of forming integrated assemblies having conductive material...

Methods of forming integrated circuitry

Methods of forming integrated assemblies having conductive material...

Assemblies having conductive structures along pillars of semiconduc...

Patents Applicationslast 30 patents

Methods of Forming Integrated Assemblies Having Conductive Material...

Methods of Forming Integrated Assemblies Having Conductive Material...

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

Methods of Forming Integrated Assemblies Having Conductive Material...

Methods of Forming Integrated Assemblies Having Conductive Material...

Methods of Forming Integrated Circuitry

Assemblies Having Conductive Structures Along Pillars of Semiconduc...