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Erich Berndlmaier
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Wappingers Falls, NY, US
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last 30 patents
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Patent Grant
Metal bump for a thermal compression bond and method for making same
Patent number
5,059,553
Issue date
Oct 22, 1991
IBM Corporation
Erich Berndlmaier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bump for a thermal compression bond and method for making same
Patent number
5,053,851
Issue date
Oct 1, 1991
International Business Machines Corp.
Erich Berndlmaier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power control means for eliminating circuit to circuit delay differ...
Patent number
4,346,343
Issue date
Aug 24, 1982
International Business Machines Corporation
Erich Berndlmaier
G05 - CONTROLLING REGULATING
Information
Patent Grant
Heat transfer structure for integrated circuit package
Patent number
4,323,914
Issue date
Apr 6, 1982
International Business Machines Corporation
Erich Berndlmaier
H01 - BASIC ELECTRIC ELEMENTS