Erich William Gerbsch

Person

Brownsburg, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid cooled electronics assembly suitable to use electrically con...
- Patent number 8,699,225
- Issue date Apr 15, 2014
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor power module with flexible circuit leadframe
- Patent number 7,960,817
- Issue date Jun 14, 2011
- Delphi Technologies, Inc.
- Erich W. Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled semiconductor power module having double-sided cooling
- Patent number 7,834,448
- Issue date Nov 16, 2010
- Delphi Technologies, Inc.
- Erich W. Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided substrate integrated circuit package including a leadfra...
- Patent number 7,697,303
- Issue date Apr 13, 2010
- Delphi Technologies, Inc.
- Roger A Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having integral fluid cooling
- Patent number 7,538,425
- Issue date May 26, 2009
- Delphi Technologies, Inc.
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical laminated electrical switch circuit
- Patent number 7,423,332
- Issue date Sep 9, 2008
- Delphi Technologies, Inc.
- Erich W. Gerbsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly having multiple side cooling and method
- Patent number 7,295,433
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-sided substrate integrated circuit package including a leadfra...
- Patent number 7,148,564
- Issue date Dec 12, 2006
- Delphi Technologies, Inc.
- Roger A Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated and thermally conductive double-sided pre-pac...
- Patent number 7,095,098
- Issue date Aug 22, 2006
- Delphi Technologies, Inc.
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically isolated and thermally conductive double-sided pre-pac...
- Patent number 6,812,553
- Issue date Nov 2, 2004
- Delphi Technologies, Inc.
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automotive electronics heat exchanger
- Patent number 6,639,798
- Issue date Oct 28, 2003
- Delphi Technologies, Inc.
- Michael A Jeter
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Interconnect assembly for an electronic assembly and assembly metho...
- Patent number 6,575,765
- Issue date Jun 10, 2003
- Delphi Technologies, Inc.
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel dual switch module
- Patent number 6,054,765
- Issue date Apr 25, 2000
- Delco Electronics Corporation
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLED ELECTRONICS ASSEMBLY SUITABLE TO USE ELECTRICALLY CON...
- Publication number 20130258592
- Publication date Oct 3, 2013
- Delphi Technologies, Inc.
- SCOTT D. BRANDENBURG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-SIDED SUBSTATE INTEGRATED CIRCUIT PACKAGE INCLUDING A LEADFRAM...
- Publication number 20100133672
- Publication date Jun 3, 2010
- Delphi Technologies, Inc.
- Roger A. Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid cooled semiconductor power module having double-sided cooling
- Publication number 20090057882
- Publication date Mar 5, 2009
- Erich W. Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor power module with flexible circuit leadframe
- Publication number 20090057853
- Publication date Mar 5, 2009
- Erich W. Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thick thick film on ceramic substrate
- Publication number 20090001546
- Publication date Jan 1, 2009
- Lynda G. Flederbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-sided substrate integrated circuit package including a leadfra...
- Publication number 20080198568
- Publication date Aug 21, 2008
- DELPHI TECHNOLOGIES, INC.
- Roger A. Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics assembly having multiple side cooling and method
- Publication number 20070097627
- Publication date May 3, 2007
- Ralph S. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual-sided substrate integrated circuit package including a leadfra...
- Publication number 20070069348
- Publication date Mar 29, 2007
- DELPHI TECHNOLOGIES, INC.
- Roger A. Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package having integral fluid cooling
- Publication number 20060022334
- Publication date Feb 2, 2006
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual-sided substrate integrated circuit package including a leadfra...
- Publication number 20050179123
- Publication date Aug 18, 2005
- Roger A. Mock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical laminated electrical switch circuit
- Publication number 20050047186
- Publication date Mar 3, 2005
- Erich W. Gerbsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically isolated and thermally conductive double-sided pre-pac...
- Publication number 20050035442
- Publication date Feb 17, 2005
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTI-CHIP CIRCUIT COMPONENT
- Publication number 20040094828
- Publication date May 20, 2004
- DELPHI TECHNOLOGIES, INC.
- Robert J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically isolated and thermally conductive double-sided pre-pac...
- Publication number 20030132511
- Publication date Jul 17, 2003
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLY FOR AN ELECTRONIC ASSEMBLY AND ASSEMBLY METHO...
- Publication number 20020106912
- Publication date Aug 8, 2002
- Erich William Gerbsch
- H01 - BASIC ELECTRIC ELEMENTS

Erich William Gerbsch

Person

Patents Grantslast 30 patents

Liquid cooled electronics assembly suitable to use electrically con...

Semiconductor power module with flexible circuit leadframe

Fluid cooled semiconductor power module having double-sided cooling

Dual-sided substrate integrated circuit package including a leadfra...

Power semiconductor package having integral fluid cooling

Vertical laminated electrical switch circuit

Electronics assembly having multiple side cooling and method

Dual-sided substrate integrated circuit package including a leadfra...

Electrically isolated and thermally conductive double-sided pre-pac...

Electrically isolated and thermally conductive double-sided pre-pac...

Automotive electronics heat exchanger

Interconnect assembly for an electronic assembly and assembly metho...

Parallel dual switch module

Patents Applicationslast 30 patents

LIQUID COOLED ELECTRONICS ASSEMBLY SUITABLE TO USE ELECTRICALLY CON...

DUAL-SIDED SUBSTATE INTEGRATED CIRCUIT PACKAGE INCLUDING A LEADFRAM...

Fluid cooled semiconductor power module having double-sided cooling

Semiconductor power module with flexible circuit leadframe

Ultra-thick thick film on ceramic substrate

Dual-sided substrate integrated circuit package including a leadfra...

Electronics assembly having multiple side cooling and method

Dual-sided substrate integrated circuit package including a leadfra...

Power semiconductor package having integral fluid cooling

Dual-sided substrate integrated circuit package including a leadfra...

Vertical laminated electrical switch circuit

Electrically isolated and thermally conductive double-sided pre-pac...

DOUBLE-SIDED MULTI-CHIP CIRCUIT COMPONENT

Electrically isolated and thermally conductive double-sided pre-pac...

INTERCONNECT ASSEMBLY FOR AN ELECTRONIC ASSEMBLY AND ASSEMBLY METHO...