Erik A. EDELBERG

Person

San Ramon, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-high aspect ratio dielectric etch
- Patent number 8,906,194
- Issue date Dec 9, 2014
- Lam Research Corporation
- Kyeong-Koo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing twisting in ultra-high aspect ratio dielectric etch
- Patent number 8,741,165
- Issue date Jun 3, 2014
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for high aspect ratio dielectric etch
- Patent number 8,475,673
- Issue date Jul 2, 2013
- Lam Research Company
- Erik A. Edelberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High strip rate downstream chamber
- Patent number 8,425,682
- Issue date Apr 23, 2013
- Lam Research Corporation
- Ing-Yann Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High strip rate downstream chamber
- Patent number 8,298,336
- Issue date Oct 30, 2012
- Lam Research Corporation
- Ing-Yann Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for plasma etching performance enhancement
- Patent number 7,977,390
- Issue date Jul 12, 2011
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high aspect ratio dielectric etch
- Patent number 7,682,986
- Issue date Mar 23, 2010
- Lam Research Corporation
- Kyeong-Koo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed ultra-high aspect ratio dielectric etch
- Patent number 7,547,636
- Issue date Jun 16, 2009
- Lam Research Corporation
- Kyeong-Koo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,542,134
- Issue date Jun 2, 2009
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,397,555
- Issue date Jul 8, 2008
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
Method for planarization etch with in-situ monitoring by interferom...
- Patent number 7,204,934
- Issue date Apr 17, 2007
- Lam Research Corporation
- Linda Braly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching photoresist on substrates
- Patent number 7,083,903
- Issue date Aug 1, 2006
- Lam Research Corporation
- Erik A. Edelberg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH STRIP RATE DOWNSTREAM CHAMBER
- Publication number 20140261803
- Publication date Sep 18, 2014
- Ing-Yann Wang
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
METHOD AND APPARATUS FOR HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20130264201
- Publication date Oct 10, 2013
- Erik A. EDELBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH STRIP RATE DOWNSTREAM CHAMBER
- Publication number 20130025693
- Publication date Jan 31, 2013
- LAM RESEARCH CORPORATION
- Ing-Yann Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20110021030
- Publication date Jan 27, 2011
- LAM RESEARCH CORPORATION
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20100273332
- Publication date Oct 28, 2010
- LAM RESEARCH CORPORATION
- Erik A. Edelberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20100132889
- Publication date Jun 3, 2010
- LAM RESEARCH CORPORATION
- Kyeong-Koo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION
- Publication number 20080273195
- Publication date Nov 6, 2008
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20080188081
- Publication date Aug 7, 2008
- Lam Research Corporation
- Kyeong-Koo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20080188082
- Publication date Aug 7, 2008
- Lam Research Corporation
- Kyeong-Koo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of etching photoresist on substrates
- Publication number 20080182422
- Publication date Jul 31, 2008
- LAM RESEARCH CORPORATION
- Erik A. Edelberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20080119055
- Publication date May 22, 2008
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma etching performance enhancement
- Publication number 20070026677
- Publication date Feb 1, 2007
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of removing resist from substrates in resist stripping cham...
- Publication number 20060228889
- Publication date Oct 12, 2006
- Erik A. Edelberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
High strip rate downstream chamber
- Publication number 20060219361
- Publication date Oct 5, 2006
- Lam Research Corporation
- Ing-Yann Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of etching photoresist on substrates
- Publication number 20060201911
- Publication date Sep 14, 2006
- Lam Research Corporation
- Erik A. Edelberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
System, method and apparatus for in-situ substrate inspection
- Publication number 20060139450
- Publication date Jun 29, 2006
- Lam Research Corp.
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
Methods of etching photoresist on substrates
- Publication number 20060051965
- Publication date Mar 9, 2006
- Lam Research Corporation
- Erik A. Edelberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of etching photoresist on substrates
- Publication number 20040256357
- Publication date Dec 23, 2004
- Erik A. Edelberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Erik A. EDELBERG

Person

Patents Grantslast 30 patents

Ultra-high aspect ratio dielectric etch

Reducing twisting in ultra-high aspect ratio dielectric etch

Method and apparatus for high aspect ratio dielectric etch

High strip rate downstream chamber

High strip rate downstream chamber

Method for plasma etching performance enhancement

Ultra-high aspect ratio dielectric etch

Pulsed ultra-high aspect ratio dielectric etch

System, method and apparatus for in-situ substrate inspection

System, method and apparatus for in-situ substrate inspection

Method for planarization etch with in-situ monitoring by interferom...

Methods of etching photoresist on substrates

Patents Applicationslast 30 patents

HIGH STRIP RATE DOWNSTREAM CHAMBER

METHOD AND APPARATUS FOR HIGH ASPECT RATIO DIELECTRIC ETCH

HIGH STRIP RATE DOWNSTREAM CHAMBER

REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

METHOD AND APPARATUS FOR HIGH ASPECT RATIO DIELECTRIC ETCH

ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION

ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

PULSED ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

Methods of etching photoresist on substrates

REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

Method for plasma etching performance enhancement

Methods of removing resist from substrates in resist stripping cham...

High strip rate downstream chamber

Methods of etching photoresist on substrates

System, method and apparatus for in-situ substrate inspection

Methods of etching photoresist on substrates

Methods of etching photoresist on substrates