Erik Engdahl

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Linear reciprocating disposable belt polishing method and apparatus
- Patent number 6,746,320
- Issue date Jun 8, 2004
- Lam Research Corporation
- Wilbur Krusell
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for controlling leading edge and trailing edge polishing
- Patent number 6,729,945
- Issue date May 4, 2004
- Lam Research Corporation
- Cangshan Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Low friction gimbaled substrate holder for CMP apparatus
- Patent number 6,716,093
- Issue date Apr 6, 2004
- Lam Research Corporation
- Erik H. Engdahl
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioning mechanism in a chemical mechanical polishing apparatus...
- Patent number 6,645,046
- Issue date Nov 11, 2003
- Lam Research Corporation
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Grant
Method of transporting a semiconductor wafer in a wafer polishing s...
- Patent number 6,517,418
- Issue date Feb 11, 2003
- Lam Research Corporation
- Erik H. Engdahl
- B24 - GRINDING POLISHING
Information Patent Grant
Linear reciprocating disposable belt polishing method and apparatus
- Patent number 6,500,056
- Issue date Dec 31, 2002
- Lam Research Corporation
- Wilbur Krusell
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for chemical mechanical planarization and poli...
- Patent number 6,428,394
- Issue date Aug 6, 2002
- Lam Research Corporation
- Ben Mooring
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing semiconductor wafers
- Patent number 6,336,845
- Issue date Jan 8, 2002
- Lam Research Corporation
- Erik H. Engdahl
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for in-situ end-point detection and optimizati...
- Patent number 6,261,155
- Issue date Jul 17, 2001
- Lam Research Corporation
- Rahul Jairath
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for stabilizing the process temperature during...
- Patent number 6,224,461
- Issue date May 1, 2001
- Lam Research Corporation
- Robert G. Boehm
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for in-situ end-point detection and optimizati...
- Patent number 6,146,248
- Issue date Nov 14, 2000
- Lam Research Corporation
- Rahul Jairath
- B24 - GRINDING POLISHING
Information Patent Grant
Sensors for a linear polisher
- Patent number 5,762,536
- Issue date Jun 9, 1998
- Lam Research Corporation
- Anil K. Pant
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Low friction gimbaled substrate holder for CMP apparatus
- Publication number 20030109208
- Publication date Jun 12, 2003
- Erik H. Engdahl
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for controlling leading edge and trailing edge polishing
- Publication number 20020146972
- Publication date Oct 10, 2002
- Cangshan Xu
- B24 - GRINDING POLISHING
Information Patent Application
Linear reciprocating disposable belt polishing method and apparatus
- Publication number 20020123298
- Publication date Sep 5, 2002
- Lam Research Corporation
- Wilbur Krusell
- B24 - GRINDING POLISHING
Information Patent Application
Method of transporting a semiconductor wafer in a wafer polishing s...
- Publication number 20010039168
- Publication date Nov 8, 2001
- Lam Research Corporation
- Erik H. Engdahl
- B24 - GRINDING POLISHING

Erik Engdahl

Person

Patents Grantslast 30 patents

Linear reciprocating disposable belt polishing method and apparatus

Apparatus for controlling leading edge and trailing edge polishing

Low friction gimbaled substrate holder for CMP apparatus

Conditioning mechanism in a chemical mechanical polishing apparatus...

Method of transporting a semiconductor wafer in a wafer polishing s...

Linear reciprocating disposable belt polishing method and apparatus

Method and apparatus for chemical mechanical planarization and poli...

Method and apparatus for polishing semiconductor wafers

Method and apparatus for in-situ end-point detection and optimizati...

Method and apparatus for stabilizing the process temperature during...

Method and apparatus for in-situ end-point detection and optimizati...

Sensors for a linear polisher

Patents Applicationslast 30 patents

Low friction gimbaled substrate holder for CMP apparatus

Apparatus for controlling leading edge and trailing edge polishing

Linear reciprocating disposable belt polishing method and apparatus

Method of transporting a semiconductor wafer in a wafer polishing s...