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Erik J. Roggeman
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Fishkill, NY, US
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last 30 patents
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Patent Grant
Barrier for interconnect and method
Patent number
6,992,389
Issue date
Jan 31, 2006
International Business Machines Corporation
Panayotis C. Andricacos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial seed layer process for forming C4 solder bumps
Patent number
6,622,907
Issue date
Sep 23, 2003
International Business Machines Corporation
Lisa A. Fanti
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
BARRIER FOR INTERCONNECT AND METHOD
Publication number
20050245070
Publication date
Nov 3, 2005
International Business Machines Corporation
Panayotis C. Andricacos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS
Publication number
20030155408
Publication date
Aug 21, 2003
International Business Machines Corporation
Lisa A. Fanti
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR