Erik Nino Tolentino

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding module pins to an electronic substrate
- Patent number 12,160,060
- Issue date Dec 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,791,288
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 11,776,870
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding module pins to an electronic substrate
- Patent number 11,626,677
- Issue date Apr 11, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 11,348,878
- Issue date May 31, 2022
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor die and related methods
- Patent number 10,700,018
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper semiconductor packages and related methods
- Patent number 10,546,798
- Issue date Jan 28, 2020
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper semiconductor packages and related methods
- Patent number 9,991,185
- Issue date Jun 5, 2018
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper semiconductor packages and related methods
- Patent number 9,659,837
- Issue date May 23, 2017
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20250070493
- Publication date Feb 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20240006266
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20230246364
- Publication date Aug 3, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
- Publication number 20220254734
- Publication date Aug 11, 2022
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
- Publication number 20210359445
- Publication date Nov 18, 2021
- Semiconductor Components Industries, LLC
- Erik Nino Mercado TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20210225730
- Publication date Jul 22, 2021
- Semiconductor Components Industries, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
- Publication number 20200294935
- Publication date Sep 17, 2020
- Semiconductor Components Industries, LLC
- Erik Nino TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Related Methods
- Publication number 20200286865
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20200161209
- Publication date May 21, 2020
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS
- Publication number 20200144200
- Publication date May 7, 2020
- Semiconductor Components Industries, LLC
- Erik Nino TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180261525
- Publication date Sep 13, 2018
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20170221792
- Publication date Aug 3, 2017
- Semiconductor Components Industries, LLC
- Erik Nino TOLENTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20160225693
- Publication date Aug 4, 2016
- Semiconductor Components Industries, LLC
- Erik Nino Tolentino
- H01 - BASIC ELECTRIC ELEMENTS

Erik Nino Tolentino

Person

Patents Grantslast 30 patents

Direct bonded copper substrates fabricated using silver sintering

Bonding module pins to an electronic substrate

Semiconductor package and related methods

Reinforced semiconductor die and related methods

Direct bonded copper substrates fabricated using silver sintering

Bonding module pins to an electronic substrate

Reinforced semiconductor die and related methods

Reinforced semiconductor die and related methods

Direct bonded copper semiconductor packages and related methods

Direct bonded copper semiconductor packages and related methods

Direct bonded copper semiconductor packages and related methods

Patents Applicationslast 30 patents

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

Semiconductor Package and Related Methods

DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS

REINFORCED SEMICONDUCTOR DIE AND RELATED METHODS

DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS

DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS

DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS