Erik Reddington

Person

Ashland, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,104,782
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,100,421
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,006,136
- Issue date Jun 26, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 9,932,684
- Issue date Apr 3, 2018
- Rohm and Haas Electronic Materials LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating compositions and methods
- Patent number 8,956,523
- Issue date Feb 17, 2015
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for forming metal contacts
- Patent number 8,536,049
- Issue date Sep 17, 2013
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal plating compositions
- Patent number 8,337,688
- Issue date Dec 25, 2012
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal plating compositions and methods
- Patent number 8,329,018
- Issue date Dec 11, 2012
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plating bath and method
- Patent number 8,268,158
- Issue date Sep 18, 2012
- Rohm and Haas Electronic Materials LLC
- Zukhra I. Niazimbetova
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Metal plating compositions
- Patent number 8,048,284
- Issue date Nov 1, 2011
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal plating compositions and methods
- Patent number 8,012,334
- Issue date Sep 6, 2011
- Rohm and Haas Electronic Materials LLC
- Erik Reddington
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bath analysis
- Patent number 7,384,535
- Issue date Jun 10, 2008
- Rohm and Haas Electronic Materials LLC
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,911,068
- Issue date Jun 28, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,773,573
- Issue date Aug 10, 2004
- Shipley Company, L.L.C.
- David R. Gabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,736,954
- Issue date May 18, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,652,731
- Issue date Nov 25, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037526
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170042037
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037527
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037528
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL PLATING COMPOSITIONS AND METHODS
- Publication number 20140081045
- Publication date Mar 20, 2014
- Rohm and Haas Electronic Materials L.L.C.
- Erik Reddington
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD FOR FORMING METAL CONTACTS
- Publication number 20120129332
- Publication date May 24, 2012
- ALLIANCE FOR SUSTAINABLE ENERGY, LLC
- Erik REDDINGTON
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METAL PLATING COMPOSITIONS
- Publication number 20120034371
- Publication date Feb 9, 2012
- Rohm and Haas Electronic Materials L.L.C.
- Erik Reddington
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL PLATING COMPOSITIONS AND METHODS
- Publication number 20110318479
- Publication date Dec 29, 2011
- Rohm and Haas Electronic Materials L.L.C.
- Erik Reddington
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING BATH AND METHOD
- Publication number 20110290660
- Publication date Dec 1, 2011
- Rohm and Haas Electronic Materials L.L.C.
- Zukhra I. Niazimbetova
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method
- Publication number 20110220512
- Publication date Sep 15, 2011
- Rohm and Haas Electronic Materials L.L.C.
- Zukhra I. Niazimbetova
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal plating compositions
- Publication number 20080269395
- Publication date Oct 30, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Erik Reddington
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal plating compositions and methods
- Publication number 20080268138
- Publication date Oct 30, 2008
- Rohm and Haas Electronic Materials L.L.C.
- Erik Reddington
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Analysis method
- Publication number 20060151327
- Publication date Jul 13, 2006
- Rohm and Haas Electronic Materials, L.L.C.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reverse pulse plating composition and method
- Publication number 20060081475
- Publication date Apr 20, 2006
- Shipley Company, L.L.C.
- Leon R. Barstad
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050155866
- Publication date Jul 21, 2005
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050139118
- Publication date Jun 30, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reverse pulse plating composition and method
- Publication number 20050016858
- Publication date Jan 27, 2005
- Shipley Company, L.L.C.
- Leon R. Barstad
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bath analysis
- Publication number 20050016856
- Publication date Jan 27, 2005
- Rohm and Haas Electronic Materials, L.L.C.
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040206631
- Publication date Oct 21, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040104124
- Publication date Jun 3, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040074778
- Publication date Apr 22, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030102226
- Publication date Jun 5, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030085132
- Publication date May 8, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030070934
- Publication date Apr 17, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030066756
- Publication date Apr 10, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Erik Reddington

Person

Patents Grantslast 30 patents

Method of electroplating photoresist defined features from copper e...

Method of electroplating photoresist defined features from copper e...

Method of electroplating photoresist defined features from copper e...

Method of electroplating photoresist defined features from copper e...

Metal plating compositions and methods

Method for forming metal contacts

Metal plating compositions

Metal plating compositions and methods

Plating bath and method

Metal plating compositions

Metal plating compositions and methods

Bath analysis

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Patents Applicationslast 30 patents

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METAL PLATING COMPOSITIONS AND METHODS

METHOD FOR FORMING METAL CONTACTS

METAL PLATING COMPOSITIONS

METAL PLATING COMPOSITIONS AND METHODS

PLATING BATH AND METHOD

Plating bath and method

Metal plating compositions

Metal plating compositions and methods

Analysis method

Reverse pulse plating composition and method

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Reverse pulse plating composition and method

Bath analysis

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate