TREA

Erik Tarvin

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  • South Boston, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for capping a MEMS wafer
    • Patent number 8,058,144
    • Issue date Nov 15, 2011
    • Analog Devices, Inc.
    • Milind Bhagavat
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Capped wafer method and apparatus
    • Patent number 7,981,723
    • Issue date Jul 19, 2011
    • Analog Devices, Inc.
    • Xue'en Yang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    Capped Wafer Method and Apparatus
    • Publication number 20100117221
    • Publication date May 13, 2010
    • Analog Devices, Inc.
    • Xue'en Yang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Method for Capping a MEMS Wafer
    • Publication number 20090294879
    • Publication date Dec 3, 2009
    • Analog Devices, Inc.
    • Milind Bhagavat
    • B81 - MICRO-STRUCTURAL TECHNOLOGY