Erik Vick

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redundant pixel layouts
- Patent number 12,236,825
- Issue date Feb 25, 2025
- X Display Company Technology Limited
- Ronald S. Cok
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Modules with integrated circuits and devices
- Patent number 11,881,475
- Issue date Jan 23, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-formed interconnects for redundant devices
- Patent number 11,804,431
- Issue date Oct 31, 2023
- Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modules with integrated circuits and devices
- Patent number 11,488,943
- Issue date Nov 1, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-formed interconnects for redundant devices
- Patent number 11,282,786
- Issue date Mar 22, 2022
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel modules with controllers and light emitters
- Patent number 10,944,027
- Issue date Mar 9, 2021
- X Display Company Technology Limited
- Christopher Andrew Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic packages with three-dimensional conductive planes, and m...
- Patent number 10,418,344
- Issue date Sep 17, 2019
- Micross Advanced Interconnect Technology LLC
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic assemblies with embedded electronic devices and...
- Patent number 10,264,669
- Issue date Apr 16, 2019
- Research Triangle Institute
- Jay Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional electronic packages utilizing unpatterned adhesiv...
- Patent number 9,576,889
- Issue date Feb 21, 2017
- Research Triangle Institute
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices utilizing contact pads with protrusions and meth...
- Patent number 9,257,335
- Issue date Feb 9, 2016
- Research Triangle Institute
- Erik Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding utilizing a patterned adhesion layer
- Patent number 8,361,901
- Issue date Jan 29, 2013
- Research Triangle Institute
- Erik P Vick
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
MODULES WITH INTEGRATED CIRCUITS AND DEVICES
- Publication number 20240105698
- Publication date Mar 28, 2024
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES
- Publication number 20240014129
- Publication date Jan 11, 2024
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULES WITH INTEGRATED CIRCUITS AND DEVICES
- Publication number 20220320061
- Publication date Oct 6, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES
- Publication number 20220165666
- Publication date May 26, 2022
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL MODULES WITH CONTROLLERS AND LIGHT EMITTERS
- Publication number 20210151630
- Publication date May 20, 2021
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULES WITH INTEGRATED CIRCUITS AND DEVICES
- Publication number 20210043618
- Publication date Feb 11, 2021
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL MODULES WITH CONTROLLERS AND LIGHT EMITTERS
- Publication number 20200395510
- Publication date Dec 17, 2020
- X-Celeprint Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES
- Publication number 20200194370
- Publication date Jun 18, 2020
- X-Celeprint Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT PIXEL LAYOUTS
- Publication number 20200051482
- Publication date Feb 13, 2020
- X-Celeprint Limited
- Ronald S. Cok
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND M...
- Publication number 20180151542
- Publication date May 31, 2018
- Micross Advanced Interconnect Technology LLC
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY-INTEGRATED THERMOELECTRIC COOLER
- Publication number 20170324016
- Publication date Nov 9, 2017
- Research Triangle Institute
- Philip BARLETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLIES WITH EMBEDDED ELECTRONIC DEVICES AND...
- Publication number 20170064810
- Publication date Mar 2, 2017
- Research Triangle Institute
- Jay Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES UTILIZING CONTACT PADS WITH PROTRUSIONS AND METH...
- Publication number 20150235898
- Publication date Aug 20, 2015
- Research Triangle Institute
- Erik Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING UTILIZING A PATTERNED ADHESION LAYER
- Publication number 20100270685
- Publication date Oct 28, 2010
- Research Triangle Institute
- Erik P. VICK
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Redundant pixel layouts

Modules with integrated circuits and devices

Laser-formed interconnects for redundant devices

Modules with integrated circuits and devices

Laser-formed interconnects for redundant devices

Pixel modules with controllers and light emitters

Electronic packages with three-dimensional conductive planes, and m...

Flexible electronic assemblies with embedded electronic devices and...

Three-dimensional electronic packages utilizing unpatterned adhesiv...

Electronic devices utilizing contact pads with protrusions and meth...

Die bonding utilizing a patterned adhesion layer

Patents Applicationslast 30 patents

MODULES WITH INTEGRATED CIRCUITS AND DEVICES

LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES

MODULES WITH INTEGRATED CIRCUITS AND DEVICES

LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES

PIXEL MODULES WITH CONTROLLERS AND LIGHT EMITTERS

MODULES WITH INTEGRATED CIRCUITS AND DEVICES

PIXEL MODULES WITH CONTROLLERS AND LIGHT EMITTERS

LASER-FORMED INTERCONNECTS FOR REDUNDANT DEVICES

REDUNDANT PIXEL LAYOUTS

ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND M...

HIGHLY-INTEGRATED THERMOELECTRIC COOLER

FLEXIBLE ELECTRONIC ASSEMBLIES WITH EMBEDDED ELECTRONIC DEVICES AND...

ELECTRONIC DEVICES UTILIZING CONTACT PADS WITH PROTRUSIONS AND METH...

DIE BONDING UTILIZING A PATTERNED ADHESION LAYER