Erliang Li

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Shenzhen, CN

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Patents Applicationslast 30 patents

Information Patent Application
THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE
- Publication number 20240363477
- Publication date Oct 31, 2024
- Honor Device Co., Ltd.
- Erliang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Manufacturing Heat Dissipation Structure of Electronic E...
- Publication number 20240298424
- Publication date Sep 5, 2024
- Honor Device Co., Ltd.
- Hanghang Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240237194
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240138056
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR