Ernesto Antilano JR.

Person

Binan, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,910,295
- Issue date Feb 2, 2021
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having a conductive layer protruding through a lead recess
- Patent number 10,796,984
- Issue date Oct 6, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,541,196
- Issue date Jan 21, 2020
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 10,483,191
- Issue date Nov 19, 2019
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
QFN pre-molded leadframe having a solder wettable sidewall on each...
- Patent number 10,079,198
- Issue date Sep 18, 2018
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20200135623
- Publication date Apr 30, 2020
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20200020616
- Publication date Jan 16, 2020
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20190148271
- Publication date May 16, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...
- Publication number 20180358286
- Publication date Dec 13, 2018
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20180190575
- Publication date Jul 5, 2018
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20180016133
- Publication date Jan 18, 2018
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ernesto Antilano JR.

Person

Patents Grantslast 30 patents

Bottom package exposed die MEMS pressure sensor integrated circuit...

QFN pre-molded leadframe having a solder wettable sidewall on each...

Leadframe having a conductive layer protruding through a lead recess

QFN pre-molded leadframe having a solder wettable sidewall on each...

Bottom package exposed die MEMS pressure sensor integrated circuit...

QFN pre-molded leadframe having a solder wettable sidewall on each...

Patents Applicationslast 30 patents

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE

QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH...

LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...