Ernst Eiper

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 11,721,586
- Issue date Aug 8, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-interface IC card components and method for manufacturing the...
- Patent number 9,536,188
- Issue date Jan 3, 2017
- NXP B.V.
- Patrick Schoengrundner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC package with stainless steel leadframe
- Patent number 8,884,415
- Issue date Nov 11, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES
- Publication number 20230326796
- Publication date Oct 12, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Regulating Plasma Dicing Rates
- Publication number 20210193524
- Publication date Jun 24, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- G01 - MEASURING TESTING
Information Patent Application
DUAL-INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...
- Publication number 20150278674
- Publication date Oct 1, 2015
- NXP B.V.
- Patrick Schoengrundner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC PACKAGE WITH STAINLESS STEEL LEADFRAME
- Publication number 20140239471
- Publication date Aug 28, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS