Ertle Werner

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Neubiberg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer with electrically connected contact and test areas
- Patent number 8,753,901
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Ertle Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with electrically connected contact and test areas
- Patent number 8,044,394
- Issue date Oct 25, 2011
- Infineon Technologies AG
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure integrated under a pad
- Patent number 7,190,077
- Issue date Mar 13, 2007
- Infineon Technologies AG
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER WITH ELECTRICALLY CONNECTED CONTACT AND TEST AREAS
- Publication number 20110294238
- Publication date Dec 1, 2011
- INFINEON TECHNOLOGIES AG
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with electrically connected contact and test areas
- Publication number 20060097386
- Publication date May 11, 2006
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor circuit, and corresponding sem...
- Publication number 20050285199
- Publication date Dec 29, 2005
- Wolfgang Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure integrated under a pad
- Publication number 20050242374
- Publication date Nov 3, 2005
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS