Erubi SUZUKI

Follow

Person

Tamba-shi, Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
- Patent number 11,631,653
- Issue date Apr 18, 2023
- Mitsubishi Electric Corporation
- Minoru Egusa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
- Patent number 11,569,197
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Minoru Egusa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,872,877
- Issue date Dec 22, 2020
- Mitsubishi Electric Corporation
- Erubi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200227381
- Publication date Jul 16, 2020
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING APPARATUS, ULTRASONIC BONDING INSPECTION METHOD...
- Publication number 20200035642
- Publication date Jan 30, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Minoru EGUSA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR