Erwin Aguas Sangalang

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with leadframe and method of ma...
- Patent number 8,492,887
- Issue date Jul 23, 2013
- Stats Chippac Ltd.
- Jayby Agno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with dual row lead-frame having...
- Patent number 8,115,287
- Issue date Feb 14, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MA...
- Publication number 20110233743
- Publication date Sep 29, 2011
- Jayby Agno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL ROW LEAD-FRAME HAVING...
- Publication number 20110140252
- Publication date Jun 16, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS