Erwin Cohen

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Durham, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit having die attach materials with channels and pr...
- Patent number 11,424,177
- Issue date Aug 23, 2022
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust electronics mounting device
- Patent number 10,886,198
- Issue date Jan 5, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust integrated circuit package
- Patent number 10,720,379
- Issue date Jul 21, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Transistor with Channeled Die Attach Materials and Process...
- Publication number 20210351121
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having Die Attach Materials with Channels and Pr...
- Publication number 20210351113
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust Electronics Mounting Device
- Publication number 20200321268
- Publication date Oct 8, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust Integrated Circuit Package
- Publication number 20200203260
- Publication date Jun 25, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS