Erwin Ian Almagro

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Dumaguete City, PH

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Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE MOLDED LEADLESS PACKAGE
- Publication number 20090212405
- Publication date Aug 27, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
- Publication number 20090091010
- Publication date Apr 9, 2009
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS