Erwin Ian ALMAGRO

Person

Lapu-Lapu City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concealed gate terminal semiconductor packages and related methods
- Patent number 11,791,247
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta Almagro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,735,508
- Issue date Aug 22, 2023
- SEMICONDUCTOR COMONENTS INDUTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,177,203
- Issue date Nov 16, 2021
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 10,256,178
- Issue date Apr 9, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230402350
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20220238421
- Publication date Jul 28, 2022
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220102248
- Publication date Mar 31, 2022
- Semiconductor Components Industries, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20220059443
- Publication date Feb 24, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20190181083
- Publication date Jun 13, 2019
- Fairchild Semiconductor Corporation
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20180068935
- Publication date Mar 8, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS

Erwin Ian ALMAGRO

Person

Patents Grantslast 30 patents

Molded packaging for wide band gap semiconductor devices

Concealed gate terminal semiconductor packages and related methods

Vertical and horizontal circuit assemblies

Vertical and horizontal circuit assemblies

Vertical and horizontal circuit assemblies

Patents Applicationslast 30 patents

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES