Esa H. Kauppinen

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Jyvaskyla, FI

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Patents Grantslast 30 patents

Information Patent Grant
Soldermask-less printed wiring board
- Patent number 8,168,892
- Issue date May 1, 2012
- Nokia Corporation
- Esa H. Kauppinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Soldermask-less printed wiring board
- Publication number 20100212940
- Publication date Aug 26, 2010
- Nokia Corporation
- Esa H. Kauppinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR