Esmaeil Rahmati

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South Burlington, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip having a ringed wiring layer interposed bet...
- Patent number 7,146,596
- Issue date Dec 5, 2006
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radial contact pad footprint and wiring for electrical components
- Patent number 6,793,500
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Bet...
- Publication number 20050050505
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS