Ethan Hsiao

Person

  • Hsin-Chu, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Contact structure

    • Patent number 11,728,170
    • Issue date Aug 15, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hong-Ying Lin
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Contact structure

    • Patent number 11,062,908
    • Issue date Jul 13, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hong-Ying Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Contact structure

    • Patent number 10,763,116
    • Issue date Sep 1, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Hong-Ying Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods of forming metal layer structures in semiconductor devices

    • Patent number 10,727,113
    • Issue date Jul 28, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Ethan Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods of forming metal layer structures in semiconductor devices

    • Patent number 10,504,775
    • Issue date Dec 10, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Ethan Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CONTACT STRUCTURE

    • Publication number 20210335616
    • Publication date Oct 28, 2021
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    • Hong-Ying LIN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Methods of Forming Metal Layer Structures in Semiconductor Devices

    • Publication number 20200111702
    • Publication date Apr 9, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ethan Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NOVEL CONTACT STRUCTURE

    • Publication number 20200043739
    • Publication date Feb 6, 2020
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    • Hong-Ying LIN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Methods of Forming Metal Layer Structures in Semiconductor Devices

    • Publication number 20190371655
    • Publication date Dec 5, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ethan Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NOVEL CONTACT STRUCTURE

    • Publication number 20190131134
    • Publication date May 2, 2019
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    • Hong-Ying LIN
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...