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Ethan Hsiao
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Hsin-Chu, TW
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last 30 patents
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Patent number
11,728,170
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hong-Ying Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Contact structure
Patent number
11,062,908
Issue date
Jul 13, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Hong-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure
Patent number
10,763,116
Issue date
Sep 1, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Hong-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming metal layer structures in semiconductor devices
Patent number
10,727,113
Issue date
Jul 28, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Ethan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming metal layer structures in semiconductor devices
Patent number
10,504,775
Issue date
Dec 10, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Ethan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
CONTACT STRUCTURE
Publication number
20210335616
Publication date
Oct 28, 2021
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Hong-Ying LIN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Methods of Forming Metal Layer Structures in Semiconductor Devices
Publication number
20200111702
Publication date
Apr 9, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Ethan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL CONTACT STRUCTURE
Publication number
20200043739
Publication date
Feb 6, 2020
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Hong-Ying LIN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Methods of Forming Metal Layer Structures in Semiconductor Devices
Publication number
20190371655
Publication date
Dec 5, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Ethan Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL CONTACT STRUCTURE
Publication number
20190131134
Publication date
May 2, 2019
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Hong-Ying LIN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...