Etsuji Suzuki

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Contact structure of lead
- Patent number 6,398,561
- Issue date Jun 4, 2002
- Soshotech Co., Ltd.
- Toshio Okuno
- G01 - MEASURING TESTING
Information Patent Grant
Resistor array board
- Patent number 6,392,530
- Issue date May 21, 2002
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making conductive bump on wiring board
- Patent number 6,351,885
- Issue date Mar 5, 2002
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interlayer connection structure
- Patent number 6,243,946
- Issue date Jun 12, 2001
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- B30 - PRESSES
Information Patent Grant
IC package having a single wiring sheet with a lead pattern dispose...
- Patent number 5,973,395
- Issue date Oct 26, 1999
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact converting structure of semiconductor chip and process for...
- Patent number 5,955,780
- Issue date Sep 21, 1999
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 5,950,306
- Issue date Sep 14, 1999
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern position detecting apparatus
- Patent number 4,644,584
- Issue date Feb 17, 1987
- Sumio Nagashima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for detecting defects in a pattern
- Patent number 4,601,577
- Issue date Jul 22, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Yukihiro Gotou
- G01 - MEASURING TESTING
Information Patent Grant
Method of convergence measurement for a color picture tube and an a...
- Patent number 4,593,309
- Issue date Jun 3, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Shinichi Uno
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for examining printed circuit board provided w...
- Patent number 4,549,206
- Issue date Oct 22, 1985
- Tokyo Shibaura Denki Kabushiki Kaisha
- Etsuji Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for conveying a lead frame mounting semiconductor pellets
- Patent number 4,516,673
- Issue date May 14, 1985
- Tokyo Shibaura Denki Kabushiki Kaisha
- Tomio Kashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for examining printed circuit board provided w...
- Patent number 4,473,842
- Issue date Sep 25, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Etsuji Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Method for automatically controlling the position of small objects
- Patent number 4,203,064
- Issue date May 13, 1980
- Tokyo Shibaura Electric Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of positioning a semiconductor member by examining it and a...
- Patent number 4,200,393
- Issue date Apr 29, 1980
- Tokyo Shibaura Elecric Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-article processing system
- Patent number 4,155,650
- Issue date May 22, 1979
- Tokyo Shibaura Electric Co., Ltd.
- Itaru Yasue
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CONTACT STRUCTURE OF LEAD
- Publication number 20020031921
- Publication date Mar 14, 2002
- Toshio Okuno
- G01 - MEASURING TESTING
Information Patent Application
Resistor array board
- Publication number 20020000906
- Publication date Jan 3, 2002
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact device and method of manufacturing the same
- Publication number 20010028111
- Publication date Oct 11, 2001
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE OF CONDUCTIVE BUMP IN WIRING BOARD
- Publication number 20010015012
- Publication date Aug 23, 2001
- ETSUJI SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS

Etsuji Suzuki

Person

Patents Grantslast 30 patents

Contact structure of lead

Resistor array board

Method of making conductive bump on wiring board

Method of forming an interlayer connection structure

IC package having a single wiring sheet with a lead pattern dispose...

Contact converting structure of semiconductor chip and process for...

Circuit board

Pattern position detecting apparatus

Method and apparatus for detecting defects in a pattern

Method of convergence measurement for a color picture tube and an a...

Method and apparatus for examining printed circuit board provided w...

Apparatus for conveying a lead frame mounting semiconductor pellets

Apparatus and method for examining printed circuit board provided w...

Method for automatically controlling the position of small objects

Method of positioning a semiconductor member by examining it and a...

Micro-article processing system

Patents Applicationslast 30 patents

CONTACT STRUCTURE OF LEAD

Resistor array board

Contact device and method of manufacturing the same

STRUCTURE OF CONDUCTIVE BUMP IN WIRING BOARD