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Etsuo Kiuchi
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Gunma, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Polishing apparatus and method
Patent number
7,513,819
Issue date
Apr 7, 2009
Shin-Eisu Handotai Co., Ltd
Etsuo Kiuchi
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing device and method
Patent number
6,827,638
Issue date
Dec 7, 2004
Shin-Etsu Handotai Co., Ltd.
Etsuo Kiuchi
B24 - GRINDING POLISHING
Information
Patent Grant
Aqueous compositions, aqueous cutting fluid using the same, method...
Patent number
6,221,814
Issue date
Apr 24, 2001
Shin-Etsu Handotai Co., Ltd.
Shingo Kaburagi
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Wire saw and method of cutting work
Patent number
6,112,737
Issue date
Sep 5, 2000
Nippei Toyama Corporation
Kazutomo Kinutani
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Tension adjusting mechanism for wire saw
Patent number
6,095,129
Issue date
Aug 1, 2000
Nippei Toyama Corporation
Yukihiro Kanemichi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Recovery of coolant and abrasive grains used in slicing semiconduct...
Patent number
6,001,265
Issue date
Dec 14, 1999
Shin-Etsu Handotai Co., Ltd.
Kohei Toyama
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method for slicing cylindrical workpieces by varying slurry conditi...
Patent number
5,937,844
Issue date
Aug 17, 1999
Shin-Etsu Handotai Co., Ltd.
Etsuo Kiuchi
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method of manufacturing wire for use in a wire saw and wire for use...
Patent number
5,927,131
Issue date
Jul 27, 1999
Shin-Etsu Handotai Co., Ltd.
Etsuo Kiuchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire saw apparatus
Patent number
5,907,988
Issue date
Jun 1, 1999
Shin-Etsu Handotai Co., Ltd.
Etsuo Kiuchi
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method of slicing semiconductor single crystal ingot
Patent number
5,875,769
Issue date
Mar 2, 1999
Shin-Etsu Handotai Co., Ltd.
Kohei Toyama
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method for cutting a workpiece with a wire saw
Patent number
5,839,425
Issue date
Nov 24, 1998
Shin-Etsu Handotai Co., Ltd.
Kouhei Toyama
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Wire saw
Patent number
5,715,807
Issue date
Feb 10, 1998
Shin-Etsu Handotai Co., Ltd.
Kouhei Toyama
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Cutting fluid, method for production thereof, and method for cuttin...
Patent number
5,693,596
Issue date
Dec 2, 1997
Shin-Etsu Handotai Co., Ltd.
Shingo Kaburagi
C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information
Patent Grant
Roller having grooves for wire saw
Patent number
5,575,189
Issue date
Nov 19, 1996
Shin-Etsu Handotai Co., Ltd.
Etsuo Kiuchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire saw and slicing method using the same
Patent number
5,269,285
Issue date
Dec 14, 1993
Shin-Etsu Handotai Company, Ltd.
Kohei Toyama
B28 - WORKING CEMENT, CLAY, OR STONE
Patents Applications
last 30 patents
Information
Patent Application
Polishing apparatus and method
Publication number
20050048882
Publication date
Mar 3, 2005
SHIN-ETSU HANDOTAI CO., LTD.
Etsuo Kiuchi
B24 - GRINDING POLISHING
Information
Patent Application
Polishing device and method
Publication number
20020187728
Publication date
Dec 12, 2002
Etsuo Kiuchi
B24 - GRINDING POLISHING