Etsuo Yamada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device by using a matrix frame
- Patent number 7,402,502
- Issue date Jul 22, 2008
- Oki Electric Industry Co., Ltd.
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a lead-on-chip device
- Patent number 6,913,951
- Issue date Jul 5, 2005
- Oki Electric Industry Co., Ltd.
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,534,845
- Issue date Mar 18, 2003
- Oki Electric Industry Co., Ltd.
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof and aggregate ty...
- Patent number 6,403,398
- Issue date Jun 11, 2002
- Oki Electric Industry Co, Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,262,482
- Issue date Jul 17, 2001
- Oki Electric Industry Co., Ltd.
- Yasushi Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having insulating tape...
- Patent number 6,258,621
- Issue date Jul 10, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof and aggregate ty...
- Patent number 6,208,021
- Issue date Mar 27, 2001
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device which is crack resistant
- Patent number 6,097,083
- Issue date Aug 1, 2000
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of resin molded type semiconductor device with embedded t...
- Patent number 6,002,181
- Issue date Dec 14, 1999
- Oki Electric Industry Co., Ltd.
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC device having chip support element and electrodes...
- Patent number 5,969,410
- Issue date Oct 19, 1999
- Oki Electric Industry Co., Ltd.
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having the inner end of connector leads displa...
- Patent number 5,874,783
- Issue date Feb 23, 1999
- Oki Electric Industry Co., Ltd.
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20030102545
- Publication date Jun 5, 2003
- Etsuo Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and aggregate ty...
- Publication number 20010001217
- Publication date May 17, 2001
- Shinji Ohuchi
- H01 - BASIC ELECTRIC ELEMENTS

Etsuo Yamada

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device by using a matrix frame

Method of making a lead-on-chip device

Semiconductor device

Semiconductor device, manufacturing method thereof and aggregate ty...

Semiconductor device

Method of fabricating a semiconductor device having insulating tape...

Semiconductor device, manufacturing method thereof and aggregate ty...

Semiconductor device which is crack resistant

Structure of resin molded type semiconductor device with embedded t...

Semiconductor IC device having chip support element and electrodes...

Semiconductor device having the inner end of connector leads displa...

Patents Applicationslast 30 patents

Semiconductor device

Semiconductor device, manufacturing method thereof and aggregate ty...