Membership
Tour
Register
Log in
Eugen MILKE
Follow
Person
Nidderau, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Aluminum coated copper bond wire and method of making the same
Patent number
9,966,355
Issue date
May 8, 2018
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Alloyed 2N copper wires for bonding in microelectronics devices
Patent number
9,589,694
Issue date
Mar 7, 2017
Heraeus Deutschland GmbH & Co. KG
Murali Sarangapani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Aluminum alloy wire for bonding applications
Patent number
9,397,064
Issue date
Jul 19, 2016
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Core-jacket bonding wire
Patent number
9,236,166
Issue date
Jan 12, 2016
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Aluminum coated copper ribbon
Patent number
9,214,444
Issue date
Dec 15, 2015
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Patents Applications
last 30 patents
Information
Patent Application
PROCESS FOR MANUFACTURING OF A THICK COPPER WIRE FOR BONDING APPLIC...
Publication number
20170200534
Publication date
Jul 13, 2017
Heraeus Deutschland GmbH & Co. KG
Eugen MILKE
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
Publication number
20170154863
Publication date
Jun 1, 2017
Heraeus Deutschland GmbH & Co. KG
Murali SARANGAPANI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
COATED WIRE FOR BONDING APPLICATIONS
Publication number
20160288272
Publication date
Oct 6, 2016
Annette LUKAS
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
COPPER BOND WIRE AND METHOD OF MAKING THE SAME
Publication number
20160078980
Publication date
Mar 17, 2016
HERAEUS MATERIALS SINGAPORE PTE., LTD.
Murali SARANGAPANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COATED WIRE FOR BONDING APPLICATIONS
Publication number
20150360316
Publication date
Dec 17, 2015
Heraeus Deutschland GmbH & Co. KG
Eugen MILKE
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ALUMINUM ALLOY WIRE FOR BONDING APPLICATIONS
Publication number
20150303165
Publication date
Oct 22, 2015
Heraeus Deutschland GmbH & Co. KG
Eugen MILKE
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME
Publication number
20150155252
Publication date
Jun 4, 2015
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Eugen Milke
B32 - LAYERED PRODUCTS
Information
Patent Application
ALUMINUM COATED COPPER RIBBON
Publication number
20150137390
Publication date
May 21, 2015
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Eugen Milke
B32 - LAYERED PRODUCTS
Information
Patent Application
ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME
Publication number
20150098170
Publication date
Apr 9, 2015
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Eugen Milke
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
CORE-JACKET BONDING WIRE
Publication number
20130213689
Publication date
Aug 22, 2013
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Eugen Milke
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Application
3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...
Publication number
20130142568
Publication date
Jun 6, 2013
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Murali SARANGAPANI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...
Publication number
20130140068
Publication date
Jun 6, 2013
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Murali SARANGAPANI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES
Publication number
20130142567
Publication date
Jun 6, 2013
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Murali SARANGAPANI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
Publication number
20130140084
Publication date
Jun 6, 2013
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Murali SARANGAPANI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...