Eugene Anthony Pruss

Person

Avon Lake, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,276,662
- Issue date Mar 15, 2022
- Vijayaraghavan Rajagopal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Devices for absorbing energy from electronic components
- Patent number 10,978,369
- Issue date Apr 13, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management assemblies suitable for use with transceivers an...
- Patent number 10,965,333
- Issue date Mar 30, 2021
- Laird Technologies, Inc.
- Gerald R. English
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly compliant non-silicone putties and thermal interface materia...
- Patent number 10,741,471
- Issue date Aug 11, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermal interface materials with reinforcement for abrasion resista...
- Patent number 10,555,439
- Issue date Feb 4, 2020
- Laird Technologies, Inc.
- Keith David Johnson
- G02 - OPTICS
Information Patent Grant
Board level shields and systems and methods of applying board level...
- Patent number 10,477,738
- Issue date Nov 12, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices for absorbing energy from electronic components
- Patent number 10,453,773
- Issue date Oct 22, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Small form-factor pluggable (SFP) transceivers
- Patent number 10,389,397
- Issue date Aug 20, 2019
- Laird Technologies, Inc.
- Björn Edgren
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Multifunctional components for electronic devices and related metho...
- Patent number 10,334,716
- Issue date Jun 25, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHOD FOR PRODUCING HOLLOW QUARTZ CYLINDERS
- Publication number 20230416135
- Publication date Dec 28, 2023
- Momentive Performance Materials Quartz, Inc.
- Eugene PRUSS
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20220246572
- Publication date Aug 4, 2022
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Devices For Absorbing Energy From Electronic Components
- Publication number 20200051891
- Publication date Feb 13, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal Management Assemblies Suitable for Use with Transceivers an...
- Publication number 20190379417
- Publication date Dec 12, 2019
- Laird Technologies, Inc.
- Gerald R. ENGLISH
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Compressible Foamed Thermal Interface Materials and Methods of Maki...
- Publication number 20190348388
- Publication date Nov 14, 2019
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGHLY COMPLIANT NON-SILICONE PUTTIES AND THERMAL INTERFACE MATERIA...
- Publication number 20190229035
- Publication date Jul 25, 2019
- Laird Technologies, Inc.
- Jason L. STRADER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Materials With Reinforcement For Abrasion Resista...
- Publication number 20190132994
- Publication date May 2, 2019
- Laird Technologies, Inc.
- Keith David JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD LEVEL SHIELDS AND SYSTEMS AND METHODS OF APPLYING BOARD LEVEL...
- Publication number 20180255666
- Publication date Sep 6, 2018
- Laird Technologies, Inc.
- Jason L. STRADER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES FOR ABSORBING ENERGY FROM ELECTRONIC COMPONENTS
- Publication number 20180182685
- Publication date Jun 28, 2018
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTIFUNCTIONAL COMPONENTS FOR ELECTRONIC DEVICES AND RELATED METHO...
- Publication number 20180153031
- Publication date May 31, 2018
- Laird Technologies, Inc.
- Jason L. Strader
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM-FACTOR PLUGGABLE (SFP) TRANSCEIVERS
- Publication number 20180034492
- Publication date Feb 1, 2018
- Laird Technologies, Inc.
- Björn Edgren
- H01 - BASIC ELECTRIC ELEMENTS

Eugene Anthony Pruss

Person

Patents Grantslast 30 patents

Compressible foamed thermal interface materials and methods of maki...

Compressible foamed thermal interface materials and methods of maki...

Compressible foamed thermal interface materials and methods of maki...

Devices for absorbing energy from electronic components

Thermal management assemblies suitable for use with transceivers an...

Highly compliant non-silicone putties and thermal interface materia...

Thermal interface materials with reinforcement for abrasion resista...

Board level shields and systems and methods of applying board level...

Devices for absorbing energy from electronic components

Small form-factor pluggable (SFP) transceivers

Multifunctional components for electronic devices and related metho...

Patents Applicationslast 30 patents

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

SYSTEMS AND METHOD FOR PRODUCING HOLLOW QUARTZ CYLINDERS

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

Devices For Absorbing Energy From Electronic Components

Thermal Management Assemblies Suitable for Use with Transceivers an...

Compressible Foamed Thermal Interface Materials and Methods of Maki...

HIGHLY COMPLIANT NON-SILICONE PUTTIES AND THERMAL INTERFACE MATERIA...

Thermal Interface Materials With Reinforcement For Abrasion Resista...

BOARD LEVEL SHIELDS AND SYSTEMS AND METHODS OF APPLYING BOARD LEVEL...

DEVICES FOR ABSORBING ENERGY FROM ELECTRONIC COMPONENTS

MULTIFUNCTIONAL COMPONENTS FOR ELECTRONIC DEVICES AND RELATED METHO...

SMALL FORM-FACTOR PLUGGABLE (SFP) TRANSCEIVERS