Eugene Chen

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film transfer using substrate with etch stop layer and diffusi...
- Patent number 12,369,352
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an image sensor
- Patent number 12,369,413
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chun Liu
Information Patent Grant
Photonic semiconductor-on-insulator (SOI) substrate and method for...
- Patent number 12,360,314
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- G02 - OPTICS
Information Patent Grant
In-situ cap for germanium photodetector
- Patent number 12,328,965
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
Information Patent Grant
Capping structure to reduce dark current in image sensors
- Patent number 12,272,716
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a photodetector with reduced dark c...
- Patent number 12,136,679
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function substrate
- Patent number 12,113,071
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 12,074,036
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming SOI substrate
- Patent number 11,955,374
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ cap for germanium photodetector
- Patent number 11,949,030
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping structure to reduce dark current in image sensors
- Patent number 11,824,077
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer using substrate with etch stop layer and diffusi...
- Patent number 11,804,531
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an image sensor
- Patent number 11,784,207
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a photodetector with reduced dark c...
- Patent number 11,749,762
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing reflective structure
- Patent number 11,721,794
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Hua Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function substrate
- Patent number 11,532,642
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an image sensor
- Patent number 11,393,866
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,257,997
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Hua Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 11,171,015
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double etch stop layer to protect semiconductor device layers from...
- Patent number 11,164,844
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 11,158,593
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping structure to reduce dark current in image sensors
- Patent number 10,861,896
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 10,643,964
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding techniques for III-V wafers and CMOS wafers
- Patent number 10,134,945
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS
- Publication number 20240379726
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSFER USING SUBSTRATE WITH ETCH STOP LAYER AND DIFFUSI...
- Publication number 20240379792
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS
- Publication number 20240379724
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...
- Publication number 20240372018
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE FOR ETCH-BACK SILICON-ON-INSULATOR PROCESS
- Publication number 20240355902
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20240332306
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOI SUBSTRATE
- Publication number 20240249974
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CAP FOR GERMANIUM PHOTODETECTOR
- Publication number 20240204120
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR...
- Publication number 20240094464
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eugene I-Chun Chen
- G02 - OPTICS
Information Patent Application
SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
- Publication number 20230395643
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Po-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...
- Publication number 20230369433
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN IMAGE SENSOR
- Publication number 20230369377
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS
- Publication number 20230361148
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...
- Publication number 20230299217
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOI SUBSTRATE
- Publication number 20230062601
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20230033270
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS
- Publication number 20230027354
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20220352211
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN IMAGE SENSOR
- Publication number 20220328556
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION SUBSTRATE
- Publication number 20220189997
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING REFLECTIVE STRUCTURE
- Publication number 20220173290
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-HUA LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CAP FOR GERMANIUM PHOTODETECTOR
- Publication number 20220131017
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR R...
- Publication number 20220059364
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...
- Publication number 20220028994
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
- Publication number 20210375669
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210202809
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-HUA LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...
- Publication number 20210135024
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN IMAGE SENSOR
- Publication number 20210098524
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE ETCH STOP LAYER TO PROTECT SEMICONDUCTOR DEVICE LAYERS FROM...
- Publication number 20210082866
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Eugene Chen

Person

Patents Grantslast 30 patents

Thin film transfer using substrate with etch stop layer and diffusi...

Method for forming an image sensor

Photonic semiconductor-on-insulator (SOI) substrate and method for...

In-situ cap for germanium photodetector

Capping structure to reduce dark current in image sensors

Semiconductor device comprising a photodetector with reduced dark c...

Multi-function substrate

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Method for forming SOI substrate

In-situ cap for germanium photodetector

Capping structure to reduce dark current in image sensors

Thin film transfer using substrate with etch stop layer and diffusi...

Method for forming an image sensor

Semiconductor device comprising a photodetector with reduced dark c...

Method for manufacturing reflective structure

Multi-function substrate

Method for forming an image sensor

Semiconductor structure

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Double etch stop layer to protect semiconductor device layers from...

Structures for bonding a group III-V device to a substrate by stack...

Capping structure to reduce dark current in image sensors

Structures for bonding a group III-V device to a substrate by stack...

Wafer to wafer bonding techniques for III-V wafers and CMOS wafers

Patents Applicationslast 30 patents

DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

THIN FILM TRANSFER USING SUBSTRATE WITH ETCH STOP LAYER AND DIFFUSI...

CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS

SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...

CARRIER STRUCTURE FOR ETCH-BACK SILICON-ON-INSULATOR PROCESS

MULTI-FUNCTION SUBSTRATE

METHOD FOR FORMING SOI SUBSTRATE

IN-SITU CAP FOR GERMANIUM PHOTODETECTOR

PHOTONIC SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR...

SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS

Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...

METHOD FOR FORMING AN IMAGE SENSOR

CAPPING STRUCTURE TO REDUCE DARK CURRENT IN IMAGE SENSORS

SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...

METHOD FOR FORMING SOI SUBSTRATE

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS

MULTI-FUNCTION SUBSTRATE

METHOD FOR FORMING AN IMAGE SENSOR

MULTI-FUNCTION SUBSTRATE

METHOD FOR MANUFACTURING REFLECTIVE STRUCTURE

IN-SITU CAP FOR GERMANIUM PHOTODETECTOR

MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR R...

Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusi...

SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING A PHOTODETECTOR WITH REDUCED DARK C...

METHOD FOR FORMING AN IMAGE SENSOR

DOUBLE ETCH STOP LAYER TO PROTECT SEMICONDUCTOR DEVICE LAYERS FROM...