Eugene R. Hollander

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Foristell, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for etching the edge of a silicon wafer
- Patent number 8,309,464
- Issue date Nov 13, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Edge etched silicon wafers
- Patent number 8,192,822
- Issue date Jun 5, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for reducing surface variations for polished wafer
- Patent number 6,479,386
- Issue date Nov 12, 2002
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING
Information Patent Grant
Apparartus for cleaning semiconductor wafers
- Patent number 5,816,274
- Issue date Oct 6, 1998
- MEMC Electronic Materials, Inc.
- Ronald D. Bartram
- B08 - CLEANING
Information Patent Grant
Apparatus for cleaning semiconductor wafers
- Patent number 5,626,159
- Issue date May 6, 1997
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- B08 - CLEANING
Information Patent Grant
Method for cleaning semiconductor wafers with sonic energy and pass...
- Patent number 5,593,505
- Issue date Jan 14, 1997
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090247055
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHED SILICON WAFERS
- Publication number 20090246444
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090242126
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS