Eugene Shalyt

Person

Washington Township, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective monitoring of multiple silicon compounds
- Patent number 11,555,798
- Issue date Jan 17, 2023
- ECI Technology, Inc.
- Eugene Shalyt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analysis of silver ion and complexing agent in tin-silver electrode...
- Patent number 10,920,336
- Issue date Feb 16, 2021
- ECI Technology, Inc.
- Vishal Parekh
- G01 - MEASURING TESTING
Information Patent Grant
Control of additive turnover in an electrodeposition solution
- Patent number 10,590,560
- Issue date Mar 17, 2020
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of silver ion and complexing agent in tin-silver electrode...
- Patent number 10,407,795
- Issue date Sep 10, 2019
- ECI Technology, Inc.
- Vishal Parekh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Palladium coating thickness measurement
- Patent number 9,593,931
- Issue date Mar 14, 2017
- ECI Technology, Inc.
- D. Morgan Tench
- G01 - MEASURING TESTING
Information Patent Grant
Etchant product analysis in alkaline etchant solutions
- Patent number 9,274,079
- Issue date Mar 1, 2016
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of an auxiliary leveler additive in an acid copper plating...
- Patent number 8,535,504
- Issue date Sep 17, 2013
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Chloride analysis in acid copper plating baths
- Patent number 8,142,640
- Issue date Mar 27, 2012
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of copper ion and complexing agent in copper plating baths
- Patent number 8,118,988
- Issue date Feb 21, 2012
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of silicon concentration in phosphoric acid etchant solutions
- Patent number 8,008,087
- Issue date Aug 30, 2011
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining the stability of an electroles...
- Patent number 7,932,094
- Issue date Apr 26, 2011
- ECI Technology, Inc.
- Eugene Shalyt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detection of additive breakdown products in acid copper plating baths
- Patent number 7,879,222
- Issue date Feb 1, 2011
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Detection of an unstable additive breakdown product in a plating bath
- Patent number 7,291,253
- Issue date Nov 6, 2007
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Efficient analysis of organic additives in an acid copper plating bath
- Patent number 7,186,326
- Issue date Mar 6, 2007
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Measurement of complexing agent concentration in an electroless pla...
- Patent number 6,890,758
- Issue date May 10, 2005
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Voltammetric measurement of halide ion concentration
- Patent number 6,673,226
- Issue date Jan 6, 2004
- ECI Technology
- Alex Kogan
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...
- Publication number 20240337628
- Publication date Oct 10, 2024
- ECI Technology, Inc.
- Jake Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE MONITORING OF BASE CHEMICALS
- Publication number 20240230608
- Publication date Jul 11, 2024
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
SELECTIVE MONITORING OF BASE CHEMICALS
- Publication number 20240133852
- Publication date Apr 25, 2024
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
NON-REAGENT CHLORIDE ANALYSIS IN ACID COPPER PLATING BATHS
- Publication number 20240125730
- Publication date Apr 18, 2024
- ECI Technology, Inc.
- Jingjing Wang
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND PROCESS CONTROL FOR REAL TIME INERT MONITORING OF ACID...
- Publication number 20230332993
- Publication date Oct 19, 2023
- ECI Technology, Inc.
- Eugene SHALYT
- G01 - MEASURING TESTING
Information Patent Application
ELECTROCHEMICAL ANALYSIS OF METALLIC DEPOLARIZERS IN GOLD ELECTRODE...
- Publication number 20230280305
- Publication date Sep 7, 2023
- ECI Technology, Inc.
- Patrick Saitta
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF BORIC ACID ANALYSIS AND PROCESS CONTROL OF METALLIZATION...
- Publication number 20230042975
- Publication date Feb 9, 2023
- ECI Technology, Inc.
- Jingjing Wang
- G01 - MEASURING TESTING
Information Patent Application
NON-REAGENT METHODS AND PROCESS CONTROL FOR MEASURING AND MONITORIN...
- Publication number 20220402772
- Publication date Dec 22, 2022
- ECI Technology, Inc.
- Eugene SHALYT
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SELECTIVE MONITORING OF MULTIPLE SILICON COMPOUNDS
- Publication number 20200110053
- Publication date Apr 9, 2020
- ECI Technology, Inc.
- Eugene Shalyt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF ADDITIVE TURNOVER IN AN ELECTRODEPOSITION SOLUTION
- Publication number 20200063285
- Publication date Feb 27, 2020
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
ANALYSIS OF SILVER ION AND COMPLEXING AGENT IN TIN-SILVER ELECTRODE...
- Publication number 20190345626
- Publication date Nov 14, 2019
- ECI Technology, Inc.
- Vishal Parekh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MEASUREMENT OF TOTAL ACCELERATOR IN AN ELECTRODEPOSITION SOLUTION
- Publication number 20180202060
- Publication date Jul 19, 2018
- ECI Technology, Inc.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANALYSIS OF SILVER ION AND COMPLEXING AGENT IN TIN-SILVER ELECTRODE...
- Publication number 20180135199
- Publication date May 17, 2018
- ECI Technology, Inc.
- Vishal Parekh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANALYSIS OF SILICON CONCENTRATION IN PHOSPHORIC ACID ETCHANT SOLUTIONS
- Publication number 20160018358
- Publication date Jan 21, 2016
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
ETCHANT PRODUCT ANALYSIS IN ALKALINE ETCHANT SOLUTIONS
- Publication number 20140206090
- Publication date Jul 24, 2014
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
PALLADIUM COATING THICKNESS MEASUREMENT
- Publication number 20140061064
- Publication date Mar 6, 2014
- ECI Technology, Inc.
- D. Morgan Tench
- G01 - MEASURING TESTING
Information Patent Application
Boric acid replenishment in electroplating baths
- Publication number 20110272289
- Publication date Nov 10, 2011
- ECI Technology, Inc.
- Eugene Shalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Analysis of an auxiliary leveler additive in an acid copper plating...
- Publication number 20110266154
- Publication date Nov 3, 2011
- ECI Technology, Inc.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for determining the stability of an electroles...
- Publication number 20100035356
- Publication date Feb 11, 2010
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fiber optic multiplexer
- Publication number 20090232448
- Publication date Sep 17, 2009
- ECI TECHNOLOGY, INC.
- Sunya Barmash
- G02 - OPTICS
Information Patent Application
Analysis of fluoride at low concentrations in acidic processing sol...
- Publication number 20090229995
- Publication date Sep 17, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
Analysis of copper ion and complexing agent in copper plating baths
- Publication number 20090194430
- Publication date Aug 6, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
Chloride analysis in acid copper plating baths
- Publication number 20090065362
- Publication date Mar 12, 2009
- ECI TECHNOLOGY, INC.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Detection of additive breakdown products in acid copper plating baths
- Publication number 20090057151
- Publication date Mar 5, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Efficient analysis of organic additives in an acid copper plating bath
- Publication number 20050263399
- Publication date Dec 1, 2005
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Detection of an unstable additive breakdown product in a plating bath
- Publication number 20050247577
- Publication date Nov 10, 2005
- ECI TECHNOLOGY, INC.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Application
Measurement of complexing agent concentration in an electroless pla...
- Publication number 20040253740
- Publication date Dec 16, 2004
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING

Eugene Shalyt

Person

Patents Grantslast 30 patents

Selective monitoring of multiple silicon compounds

Analysis of silver ion and complexing agent in tin-silver electrode...

Control of additive turnover in an electrodeposition solution

Analysis of silver ion and complexing agent in tin-silver electrode...

Palladium coating thickness measurement

Etchant product analysis in alkaline etchant solutions

Analysis of an auxiliary leveler additive in an acid copper plating...

Chloride analysis in acid copper plating baths

Analysis of copper ion and complexing agent in copper plating baths

Analysis of silicon concentration in phosphoric acid etchant solutions

Method and apparatus for determining the stability of an electroles...

Detection of additive breakdown products in acid copper plating baths

Detection of an unstable additive breakdown product in a plating bath

Efficient analysis of organic additives in an acid copper plating bath

Measurement of complexing agent concentration in an electroless pla...

Voltammetric measurement of halide ion concentration

Patents Applicationslast 30 patents

QUANTITATION OF UNSTABLE REACTION PRODUCT OR BREAKDOWN PRODUCT WITH...

SELECTIVE MONITORING OF BASE CHEMICALS

SELECTIVE MONITORING OF BASE CHEMICALS

NON-REAGENT CHLORIDE ANALYSIS IN ACID COPPER PLATING BATHS

METHODS AND PROCESS CONTROL FOR REAL TIME INERT MONITORING OF ACID...

ELECTROCHEMICAL ANALYSIS OF METALLIC DEPOLARIZERS IN GOLD ELECTRODE...

METHODS OF BORIC ACID ANALYSIS AND PROCESS CONTROL OF METALLIZATION...

NON-REAGENT METHODS AND PROCESS CONTROL FOR MEASURING AND MONITORIN...

SELECTIVE MONITORING OF MULTIPLE SILICON COMPOUNDS

CONTROL OF ADDITIVE TURNOVER IN AN ELECTRODEPOSITION SOLUTION

ANALYSIS OF SILVER ION AND COMPLEXING AGENT IN TIN-SILVER ELECTRODE...

MEASUREMENT OF TOTAL ACCELERATOR IN AN ELECTRODEPOSITION SOLUTION

ANALYSIS OF SILVER ION AND COMPLEXING AGENT IN TIN-SILVER ELECTRODE...

ANALYSIS OF SILICON CONCENTRATION IN PHOSPHORIC ACID ETCHANT SOLUTIONS

ETCHANT PRODUCT ANALYSIS IN ALKALINE ETCHANT SOLUTIONS

PALLADIUM COATING THICKNESS MEASUREMENT

Boric acid replenishment in electroplating baths

Analysis of an auxiliary leveler additive in an acid copper plating...

Method and apparatus for determining the stability of an electroles...

Fiber optic multiplexer

Analysis of fluoride at low concentrations in acidic processing sol...

Analysis of copper ion and complexing agent in copper plating baths

Chloride analysis in acid copper plating baths

Detection of additive breakdown products in acid copper plating baths

Efficient analysis of organic additives in an acid copper plating bath

Detection of an unstable additive breakdown product in a plating bath

Measurement of complexing agent concentration in an electroless pla...